A method of recycling a solar cell module includes an enclosing layer that encloses a solar cell therein, a light-receiving surface layer laminated on one surface of the enclosing layer, and a back sheet laminated on the other surface of the enclosing layer, the method including: a first removing step of mechanically removing the back sheet; a second removing step of mechanically removing from a side on which the back sheet is removed the entire solar cell and the enclosing layer to such a depth that a part of the enclosing layer having a predetermined thickness remains on the light-receiving surface layer, after the first removing step; and a third removing step of removing the part of the enclosing layer remaining on the light-receiving surface layer by immersion in a solution that causes swelling of the enclosing layer, after the second removing step, thereby improving an overall efficiency.

Multilayered polymer films are configured so that successive constituent layer packets can be delaminated in continuous sheet form from the remaining film. The films are compatible with known coextrusion manufacturing techniques, and can be made without adhesive layers between layer packets that are tailored to be individually peelable from the film. Instead, combinations of polymer compositions are used to allow non-adhesive polymer layers to be combined such that irreversible delamination of the film is likely to occur at interfaces between layer packet pairs. Some polymer layers, including at least one embedded layer, may include an ultraviolet (UV) light stabilizer such as a UV absorber, antioxidant, or hindered amine light stabilizer (HALS), and these layers may be positioned at the front of each layer packet. After the UV-stabilized layer of one packet has been used, the packet can be peeled away to expose a new UV-stabilized layer of the next layer packet.

A wafer debonding and cleaning apparatus comprises a wafer debonding module configured to separate a semiconductor wafer from a carrier wafer. The wafer debonding and cleaning apparatus also comprises a first wafer cleaning module configured perform a first cleaning process to clean a surface of the semiconductor wafer. The wafer debonding and cleaning apparatus further comprises an automatic wafer handling module configured to transfer the semiconductor wafer from one of the wafer debonding module or the first wafer cleaning module to the other of the wafer debonding module or the first wafer cleaning module. The semiconductor wafer has a thickness ranging from about 0.20 m to about 3 mm.

The disclosed technology generally relates to preparing two-dimensional material layers, and more particularly to releasing a graphene layer from a template substrate. According to an aspect, a method of releasing a graphene layer includes providing a template substrate on which the graphene layer is provided, the method comprising: subjecting the graphene layer and the template substrate to a water treatment by soaking the graphene layer and the template substrate in water such that water is intercalated between the template substrate and the graphene layer; and subjecting the graphene layer and the template substrate to a delamination process, thereby releasing the graphene layer from the template substrate.

The present invention is directed to a curable and electrochemically debondable two-component (2K) adhesive composition comprising: a first component comprising: i) at least one polyol selected from the group consisting of fatty alcohols, polyester polyols, polyether polyols, polyether-polyester polyols and polycarbonate polyols: ii) optionally further active hydrogen compounds: and, iii) non-polymerizable electrolyte: and, a second component comprising at least one polyisocyanate, wherein said composition is characterized in that the molar equivalents ratio of NCO groups to active hydrogen atoms is at least 1:1.

A monolayer film of nanoparticles can formed from a fluid mixture by combining nanoparticles dispersed in water with a water-miscible organic solvent and a molecular ligand comprising a head group with affinity for the nanoparticle, and introducing the fluid mixture to a substrate in the presence of an air/fluid interface, thereby causing a monolayer film of nanoparticles to form on the substrate. Such monolayers films can include metallic nanoparticles such as gold, and possess substantially uniform spacing over at least a one centimeter length scale. The films are metasurfaces effective to cause a range of linear refractive index of from around unity at 700 nm to 10 at 1500 nm. Such metasurfaces might find utility, for example, as ultrafast (picosecond scale) switches at wavelengths useful for telecommunications.

An electronic device comprising a cover plate is disclosed. The cover plate comprises one or more thin sapphire layers having a thickness of from about 50 microns to about 500 microns. Also disclosed are methods for preparing these thin sapphire layers.

The invention relates to an adhesive composition comprising at least one natural latex and at least one polymeric composition having a glass transition temperature ranging from 50 C. to 0 C.

The invention also relates to a membrane obtained after drying the adhesive composition according to the invention, to a combination of a flexible surface coating with an adhesive composition according to the invention, to a method for applying a flexible surface coating onto a substrate as well as a substrate coated with a peelable adhesive membrane according to the invention.

A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.

Balancing weights for cars have an adhesive tape with at least a first tape layer and a second tape layer, for attaching the balancing weights to a rim. The first tape layer is held in close proximity to a rim by a first adhesive layer. The second tape layer is held in close proximity to the balancing weights by a second adhesive layer. The first tape layer is stiffer and less flexible than the second tape layer, the second tape layer is softer and more flexible than the first tape layer. This allows easy removal of the balancing weights from the rim by pushing a wedge shaped tool between the first tape layer and the rim.