Y10T156/14

METHOD AND SYSTEM FOR ASSEMBLY OF RECESSED PANEL DOORS
20170072672 · 2017-03-16 ·

Systems and methods for pressing a door assembly involve one or more die sections installed in a press, wherein the die sections each have a raised section that contacts and supports a recessed panel portion of a door skin of the assembly during the pressing operation to facilitate crushing of portions of a core of the door assembly that underlie the recessed panel portion of the door skin. The die sections may be made of plastic and readily changed out for different sizes or styles of doors.

Apparatus and method for wafer level bonding

A system for and a method of bonding a first wafer to a second wafer are provided. A second wafer chuck has a second surface, a profile of the second surface being adjustable by a profile control layer. The first wafer is placed on a first surface of a first wafer chuck, and the second wafer is placed on the second surface of the second wafer chuck. The first wafer and the second wafer are warped prior to bonding to form a first warped wafer and a second warped wafer, respectively. The first warped wafer is bonded to the second warped wafer.

Machine for closing the tail end of a roll of web material

The machine includes a first glue-applying device for closing the tail end; and a second mechanical-closing device for mechanically anchoring the tail end of the roll to a portion of an outer turn of the web material wound on the roll.

Method for producing an extruded stiffened panel, and device for implementing same

A method for producing a part made of a composite material, including a skin and at least one stiffener made of strips, which are in turn made of one or more plies of fibers impregnated with a non-polymerized resin. The method includes the steps of: producing a preform of the part by pulling the strips through a die for shaping and positioning the skin and the stiffeners, a polymerization core being provided between a first strip and a second strip prior to the passage thereof through the die; and pressing the resulting preform in a hot press for a duration dt while applying a pressure P and at a temperature T for polymerizing the resin of the strips in the hot press over a pressing length L that is shorter than the length of the panel.