An apparatus for the production of a paper web, includes: a first embossing unit (1) with a first embossing cylinder (2) and a corresponding counter-cylinder (3) for embossing a first paper ply (4); a second embossing unit (5) with a second embossing cylinder (6) and a corresponding counter-cylinder (7) for embossing a second paper ply (8), such that, once embossed, the plies have a series of oppositely oriented reliefs (R4, R8), the embossing units (1, 5) being synchronized so that the reliefs are nested into each other; a sizing unit (1C, 2C, 3C) associated with the first embossing cylinder (2) to distribute a predetermined amount of glue on the side of the second ply (8) opposed to that from which the respective reliefs (R8) emerge; a structure (11) for joining to each other the plies (4, 8) exiting from the apparatus.

A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.

A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.

Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

A method of and system for recirculating a fluid in a particle production system. A reactor produces a reactive particle-gas mixture. A quench chamber mixes a conditioning fluid with the reactive particle-gas mixture, producing a cooled particle-gas mixture that comprises a plurality of precursor material particles and an output fluid. A filter element filters the output fluid, producing a filtered output. A temperature control module controls the temperature of the filtered output, producing a temperature-controlled, filtered output. A content ratio control module modulates the content of the temperature-controlled, filtered output, thereby producing a content-controlled, temperature-controlled, filtered output. A channeling element supplies the content-controlled, temperature-controlled, filtered output to the quench chamber, wherein the content-controlled, filtered output is provided to the quench chamber as the conditioning fluid to be used in cooling the reactive particle-gas mixture.

An apparatus for cooling a reactive mixture, comprising: a reactor configured to form the reactive mixture; a quench chamber comprising a frusto-conical body having a wide end, a narrow end, and a quench region formed between the wide and narrow end, wherein the quench chamber is configured to receive the reactive mixture from the plasma reactor through a reactive mixture inlet into the quench region, to receive a conditioning fluid through at least one fluid inlet, and to flow the conditioning fluid into the quench region, wherein the frusto-conical body is configured to produce a turbulent flow within the quench region with the flow of the conditioning fluid into the quench region, thereby promoting the quenching of the reactive mixture to form a cooled gas-particle mixture; and a suction generator configured to force the cooled gas-particle mixture out of the quench chamber.