Aspects relate to systems, methods, and apparatus for a manufacturing tool. The manufacturing tool is comprised of a vacuum tool and an ultrasonic welder as a unified manufacturing tool. The manufacturing tool may be used to pick and position a manufacturing part that is then welded with the associated ultrasonic welder.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

Disclosed is a web handling system that includes a spindle having a spindle magnetic coupling portion and a roll core configured for receiving the spindle for mounting thereon and having a roll magnetic coupling portion, wherein the spindle and roll magnetic coupling portions are configured for magnetically attracting each other to hold the roll on the spindle.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

The invention relates in general terms to a device for production of a packaging precursor, wherein the packaging precursor consists to an extent of at least 80% by weight, based on the packaging precursor (1000), of a sheetlike composite, wherein the sheetlike composite includes: i. a composite plastic layer, ii. a composite carrier layer, iii. a first composite edge region, iv. a second composite edge region, wherein the device includes, as device constituents in a flow direction: a) a flat transport unit designed to transport the flat sheetlike composite, wherein the transport unit includes a transport surface designed to bear the composite; downstream of that b) a first heating unit designed to heat the first composite edge region, where the first heating unit includes energy release segments; downstream of that c) a contacting unit designed to bond the first composite edge region to the second composite edge region;
wherein the first heating unit is designed to release energy in the flow direction. The invention further relates to a method, to a packaging precursor obtainable by the method, to a packaging precursor and to a use of the device.

Apparatus and method for producing absorbent structures with absorbent layers with channel(s) without absorbent material, using a first moving endless surface with specific raised strip(s) and a second moving endless surface with specific mating strip(s).

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.