A thickness of material may be detached from a substrate along a cleave plane, utilizing a cleaving process controlled by a releasable constraint plate. In some embodiments this constraint plate may comprise a plate that can couple side forces (the P-plate) and a thin, softer compliant layer (the S-layer) situated between the P-plate and the substrate. In certain embodiments a porous surface within the releasable constraint plate and in contact to the substrate, allows the constraint plate to be secured to the substrate via a first pressure differential. Application of a combination of a second pressure differential within a pre-existing cleaved portion, and a linear force to a side of the releasable constraint plate bound to the substrate, generates loading that results in controlled cleaving along the cleave plane.

Systems and methods for controlling wafer-breaker devices. In some embodiments, a controller for a semiconductor wafer singulation apparatus can be configured to receive an input signal having information about at least one singulation parameter. The controller can be further configured to generate an output signal based on the input signal to effectuate an operation associated with the singulation parameter. The controller can be further configured to disable manual control of the singulation parameter. In some embodiments, such a controller can be implemented, for example, in a control module, in a kit for modifying an existing singulation apparatus, as an integral part of a singulation apparatus, or any combination thereof.

A device for opening an ampoule includes an ampoule holder configured to hold a body of the ampoule along a central longitudinal axis, a head holder configured to hold a head of the ampoule, and a guide engaged with the head holder and configured to direct the head holder from a first position on the central longitudinal axis to a second position offset from the central longitudinal axis when the ampoule holder is advanced in a first direction along the central longitudinal axis from an initial position. A method for opening an ampoule includes moving the ampoule in a first direction along a central longitudinal axis, directing the head of the ampoule laterally and/or obliquely away from the central longitudinal axis to break the head of the ampoule from the body of the ampoule when the ampoule is moved in the first direction, removing material from the body of the ampoule, and removing liquid from the head of the ampoule.

An impact tool includes a core and a plurality of projections. The core is formed of a first material that has a first specific gravity and each projection is formed of a second material that has a second specific gravity. The plurality of projections is configured on the core such that at least two projections intersect a first hypothetical plane disposed on the first side of the core and at least two projections intersect a second hypothetical plane disposed on the second side of the core and that is opposably facing the first side. Each of the first and second hypothetical planes is disposed a distance from the central lengthwise axis of the core that is greater than the radius of the core and less than the sum of the radius of the core and the length of a projection.