A method of milling a piece of raw steel stock comprising: arranging a minimum of four solid pole extensions on top surface segments of a magnetic chuck such that the solid pole extensions are relatively evenly distributed under a piece of raw steel stock and within 2 inches of a perimeter of the piece of raw steel stock; arranging multiple mobile pole extensions beneath the piece of raw steel stock and on every other top surface segment of the magnetic chuck under the piece of raw steel stock that is not occupied by the solid pole extensions but beneath the piece of raw steel stock, each of the multiple mobile pole extensions having a biased top portion that contacts the piece of raw steel stock; milling the piece of raw steel stock with a face mill that generates steel chip as swarf; and recycling the steel chip.

A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.

Methods and apparatus for confining plasma in a process chamber. In some embodiments, the apparatus includes a first liner with a first set of openings, the first liner configured to surround a substrate support when installed and a second liner with a second set of openings, the second liner configured to surround the substrate support under the first liner when installed, wherein the first set of openings and the second set of openings are configured to be offset from each other when installed in the process chamber to prevent a line-of-sight through the first liner and the second liner from a top down viewpoint, and wherein the first liner and the second liner are configured to be spaced apart vertically when installed in the process chamber to allow high fluid conductance through the first set of openings and the second set of openings.

The present disclosure generally relates to apparatuses and methods for controlling a plasma sheath near a substrate edge. The apparatus relates to a processing chamber and/or a substrate support that includes an edge ring assembly with an edge ring electrode and an electrostatic chuck with a chucking electrode. The edge ring assembly is positioned adjacent the electrostatic chuck, such as with the edge ring assembly positioned exterior to or about the electrostatic chuck. The edge ring assembly includes a base and a cap positioned above the base with the edge ring electrode positioned between the cap and the base. The base of the edge ring electrode may include an inner recess and/or an outer recess with the cap including one or more lips that extend into the inner recess and/or the outer recess. One or more silicon rings and/or insulating rings are positioned adjacent the edge ring assembly.

A method of milling a piece of raw steel stock comprising: arranging a minimum of four solid pole extensions on top surface segments of a magnetic chuck such that the solid pole extensions are relatively evenly distributed under a piece of raw steel stock and within 2 inches of a perimeter of the piece of raw steel stock; arranging multiple mobile pole extensions beneath the piece of raw steel stock and on every other top surface segment of the magnetic chuck under the piece of raw steel stock that is not occupied by the solid pole extensions but beneath the piece of raw steel stock, each of the multiple mobile pole extensions having a biased top portion that contacts the piece of raw steel stock; milling the piece of raw steel stock with a face mill that generates steel chip as swarf; and recycling the steel chip.

The present disclosure generally relates to substrate supports for semiconductor processing. In one embodiment, a substrate support is provided. The substrate support includes a body comprising a substrate chucking surface, an electrode disposed within the body, a plurality of substrate supporting features formed on the substrate chucking surface, wherein the number of substrate supporting features increases radially from a center of the substrate chucking surface to an edge of the substrate chucking surface, and a seasoning layer formed on the plurality of the substrate supporting features, the seasoning layer comprising a silicon nitride.

A chuck for a machine tool having a rotation spindle with a main axis of rotation. The chuck comprises a base plate, a first rotatable plate eccentrically mounted on the base plate, a second rotatable plate eccentrically mounted on the first rotatable plate, balancing means for aligning a principal axis of inertia of the chuck with the main axis of rotation and a holding mechanism. The chuck is provided with an actuating mechanism for angularly displacing the first rotatable plate around a first rotation axis over a first angle of rotation and/or the second rotatable plate around a second rotation axis over a second angle of rotation such that the position of the object with respect to the main axis of rotation can be altered.

An electrostatic chuck assembly with improved thermal uniformity and stability is disclosed herein. The electrostatic chuck assembly includes a puck having a chucking electrode disposed therein and a cooling base connected to the puck. The cooling base is formed a first material and includes a top surface, a first cooling channel, a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel, and a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck. The first thermal spreading element is formed from a second material that has a thermal conductivity higher than a thermal conductivity of the first material.

A plasma processing apparatus includes an electrostatic chuck and a lifter pin. The electrostatic chuck has a mounting surface on which a target object is mounted and a back surface opposite to the mounting surface, and a through hole formed through the mounting surface and the back surface. The lifter pin is at least partially formed of an insulating member and has a leading end accommodated in the through hole. The lifter pin vertically moves with respect to the mounting surface to vertically transfer the target object. A conductive material is provided at at least one of a leading end portion of the lifter pin which corresponds to the through hole and a wall surface of the through hole which faces the lifter pin.

A method of milling a piece of raw steel stock comprising: presenting a piece of raw steel stock having a first surface and a second surface having a perimeter; presenting a magnetic chuck with a top surface configured to support the piece of raw steel stock for milling with magnetic capabilities; arranging a minimum of four solid pole extensions on the top surface to support the second surface of the piece of raw steel stock for milling of the first surface thereof such that the solid pole extensions will be relatively evenly distributed beneath the perimeter of the second surface; arranging multiple mobile pole extensions on the top surface to further support the second surface; placing the second surface onto the multiple mobile pole extensions and the solid pole extensions; activating the magnetic capabilities of the magnetic chuck; and milling the first surface to a desired flatness.