In debonding a temporarily adhesive-bonded carrier-workpiece pair by a combination of chemical and mechanical methods, solvents or chemicals are used to remove the adhesives primarily through dissolution, and a thin wire, filament, or blade is used to exert a cutting or wedging action between the carrier and workpiece. The two methods are used together during the debonding process. In the carrier-workpiece pair, the workpiece can be a semiconductor wafer that has been thinned and processed. The carrier and the workpiece are temporarily bonded using an adhesive dissolvable in a selected chemical or solvent. The chemical and mechanical debonding (CMDB) method can be carried out in solvent immersion or in solvent spray to provide high throughput debonding. The dissolved adhesives can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.

A method of debonding a temporarily adhesive-bonded carrier-workpiece pair employs a stream of a solvent at a high pressure. The carrier and the workpiece are bonded with an adhesive that is dissolvable in a selected solvent. The workpiece such as a device wafer may have been thinned and processed. The solvent is applied to the adhesive at a high pressure to debond and dissolve the adhesive with high throughput. The dissolved adhesive can be recycled and later reused, thus lowering the cost of the whole bonding and debonding process.

The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a roller of the peeling bar. The radius of the roller of the peeling bar and the inclined surface of the fixing unit are designed to minimize the Z-axis component of a shearing force applied to the polarizing film. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar. According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.

A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

A movable member is gripped in a delamination-start configuration, and the other-end side of a rib of a delamination member is pressed towards the other-end side of a flexible plate. The flexible plate then warps and deforms about the other end side of the flexible plate, which is supported by a support member, the flexible plate deforming along the direction in which delamination progresses. In concert with the delamination action, a reinforcing plate also warps and deforms along with the flexible plate, the reinforcing plate being vacuum-chucked to an air-permeable electroconductive sheet on the flexible plate, and the reinforcing plate is sequentially delaminated from a substrate 2 along the direction in which delamination progresses.

An apparatus, system, and a method of using the apparatus or system that includes a bladder positioned between tape and an adhesive layer configured to selectively connect the tape to a semiconductor device. The bladder includes one or more chambers that may be selectively expanded to move a portion of the bladder and adhesive layer away from the tape, which may enable the removal of the semiconductor device. The flow of fluid into each of the chambers may selectively expand the chambers. The chambers may have a substantially rounded upper profile or a substantially pointed upper profile. A material within the chambers may be heated to expand the chambers. A plurality of conduits may permit the flow of fluid into the chambers. The conduits may be inserted into the bladder. The chambers may be collapsed after expansion to enable the removal of a semiconductor device from the tape.

The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a tip of a front part of the peeling bar. The radius of a curved surface at the tip of the front part and an inclined upper surface of the front part are designed to minimize the Z-axis component of a shearing force applied to the polarizing film. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar. According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.

The present invention relates to a peeling bar, apparatus, and method for peeling a polarizing film from a panel. This invention can minimize friction between the peeling bar and the polarizing film since the peeled polarizing film is in contact with a main roller of the peeling bar. The radius of the main roller of the peeling bar and the inclined surface of the fixing unit are designed to minimize the Z-axis component of a shearing force applied to the polarizing film. Also, in order to equalize tension applied to the polarizing film in a peeling process, this invention makes both ends of the polarizing film closely adhere to the peeling bar.

According to this invention, fracture of the polarizing film is prevented, and thereby the polarizing film can be stably peeled from the panel without fracture.

A method and apparatus for delaminating a polymer film from a carrier plate is disclosed. The carrier plate is at least partially transparent and has deposited on it a pixelated pattern layer of light-absorptive material, upon which is deposited a layer of light-reflective material. A polymer film, which is to be delaminated, is deposited on the light-reflecting material layer. Next, a pulsed light source is utilized to irradiate through the carrier plate from the side opposite the polymer film to heat the light-absorptive material layer. The heated areas of the light-absorptive material layer, in turn, heat the polymer film through conduction at the interface between the light-absorptive material layer and the polymer film, thereby generating gas from the polymer film by its thermal decomposition, which allows the polymer film to be released from the carrier plate.

An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.