An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<RBL0).

A substrate transfer robot is disposed in a robot installment area defined between a first apparatus and a second apparatus including an opening. The first apparatus includes a first wall, the second apparatus including a second wall. The first apparatus accommodates the substrate at each of a lowest height position and a highest height position. The substrate transfer robot includes a base stationary, a hand configured, and an arm. The arm is rotatably mounted to the base to move the hand. The hand and the arm move in a height direction between a movable range defined between a lowest position and a highest position. The arm rotates with partially entering the opening when the substrate transfer robot takes out the substrate from the first apparatus. The substrate is accommodated at each of the lowest height position and the highest height position.

The present invention relates to an end effector including: blade members for holding substrates, each configured to hold the substrate, and configured such that each interval between the blade members can be changed; a blade support unit configured to support the blade members, the blade support unit being configured to be driven integrally with the blade members by the robot; and blade drive means configured to change the interval between the blade members by moving at least one of the blade members relative to another blade member.

A substrate transfer system includes a substrate transfer robot. The substrate transfer robot is provided between a first apparatus and a second apparatus which has a wall provided opposite to the substrate transfer robot and having an opening on the wall. The substrate transfer robot is configured to transfer a substrate from the first apparatus to the second apparatus via the opening and includes a base having a first axis, an arm body, and a hand. The arm body has a proximal end and a distal end and is connected to the base at the proximal end to rotate around the first axis. The substrate transfer robot includes a minimum distance from the first axis to an outermost portion of the arm body and the hand in a radius direction from the first axis being larger than a distance between the first axis and the opening on the wall.