Devices, compositions, and methods are described which provide a tubular nanostructure or a composite tubular nanostructure targeted to a lipid bilayer membrane. The tubular nanostructure includes a hydrophobic surface region flanked by two hydrophilic surface regions. The tubular nanostructure is configured to interact with a lipid bilayer membrane and form a pore in the lipid bilayer membrane. The tubular nanostructure may be targeted by including at least one ligand configured to bind to one or more cognates on the lipid bilayer membrane of a target cell.

A semiconductor device includes a drain, a source, a gate electrode, and a nanowire between the source and drain. The nanowire has a first section with a first thickness and a second section with a second thickness greater than the first thickness. The second section is between the first section and at least one of the source or drain. The first nanowire includes a channel when a voltage is applied to the gate electrode.

A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

A method is presented for forming a nanowire electrode. The method includes forming a plurality of nanowires over a first substrate, depositing a conducting layer over the plurality of nanowires, forming solder bumps and electrical interconnections over a second flexible substrate, and integrating nanowire electrode arrays to the second flexible substrate. The plurality of nanowires are silicon (Si) nanowires, the Si nanowires used as probes to penetrate skin of a subject to achieve electrical biopotential signals. The plurality of nanowires are formed over the first substrate by metal-assisted chemical etching.

A metal nanowire according to an embodiment of the invention includes at least one bent portion. An angle () between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0<<180.

A semiconductor package structure is provided. The semiconductor package structure includes a chip structure. The semiconductor package structure includes a first conductive structure over the chip structure. The first conductive structure is electrically connected to the chip structure. The first conductive structure includes a first transition layer over the chip structure; a first conductive layer on the first transition layer; and a second conductive layer over the first conductive layer. The first conductive layer is substantially made of twinned copper. A first average roughness of a first top surface of the second conductive layer is less than a second average roughness of a second top surface of the first conductive layer

A metal nanowire according to an embodiment of the invention includes at least one bent portion. An angle () between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0<<180.

A metal nanowire according to an embodiment of the invention includes at least one bent portion. An angle () between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0<<180. Also, a metal nanowire according to another embodiment of the invention includes at least two wire portions. The metal nanowire includes an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion. A diameter of the n-th wire portion is different from a diameter of the (n+1)-th wire portion. In addition, a core-shell nanowire according to yet another embodiment includes a nanowire core; and a metal-compound shell formed on the nanowire core. A method of manufacturing a metal nanowire according to an embodiment includes preparing a reaction mixture and synthesizing a nanowire. In the preparing the reaction mixture, a metal salt, a reducing solvent for reducing the metal salt to a melt, a capping agent for growing the metal into a shape of a wire, and a catalyst are mixed. In the synthesizing the nanowire, the mixture is added to a reaction container and is reacted in the reaction container at 1 to 5 atm. Then, the nanowire including at least two wire portions and having a bent portion is manufactured. Also, a method of manufacturing a metal nanowire according to another embodiment includes preparing a reaction mixture and synthesizing a nanowire. In the preparing the reaction mixture, a metal salt, a reducing solvent for reducing the metal salt to a melt, a capping agent for growing the metal into a shape of a wire, and a catalyst are mixed. In the synthesizing the nanowire, the mixture is added to a reaction container and is reacted in the reaction container at 1 to 5 atm. Then, the nanowire having different diameters is manufactured. In addition, a method of manufacturing a metal nanowire according to yet another embodiment preparing a nanowire core on a substrate; contacting the nanowire core with a precursor solution for forming a metal-compound shell; and forming a metal-compound shell on the nanowire core by supplying growth energy. A transparent electrode according to an embodiment includes a conductor layer including a metal nanowire; and a transparent electrode layer formed on the conductor layer. The metal nanowire includes at least one bent portion. An angle () between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0<<180. Also, a transparent electrode according to another embodiment includes a conductor layer including a metal nanowire; and a transparent e

Nanowires useful as heterogeneous catalysts are provided. The nanowire catalysts are prepared by polymer templated methods and are useful in a variety of catalytic reactions, for example, the oxidative coupling of methane to ethane and/or ethylene. Related methods for use and manufacture of the same are also disclosed.

A touch display apparatus is disclosed. The touch display apparatus includes an electrophoretic structure, a protective layer and at least one touch sensing layer. The protective layer is disposed on the electrophoretic structure. The touch sensing layer is disposed on the protective layer and takes the protective layer as a carrier.