A mounting apparatus is provided which includes a frame having a table, a support member disposed on the table to support a substrate, and a feeder mounted on a feeder mount unit disposed in the frame at one side of the table. The feeder provides an element to be attached to the substrate. An element value measuring unit is disposed adjacent one side of the frame and directly measures an element value of the element. A head unit picks up the element from the feeder, inputs the element into the element value measuring unit, and/or attaches the element to the substrate. A control device controls operations of the feeder and the head unit.

A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.

A method for manufacturing and turning a near field communication antenna is provided. A method for manufacturing and tuning a near field communication antenna comprising loading one or more ferrite substrates onto a workstation, loading an antenna biscuit onto the workstation, the antenna biscuit comprising one or more interconnected antennas, stamping the antenna biscuit to form one or more individual antennas, applying the one or more individual antennas to the one or more ferrite substrates to form one or more antenna assemblies, and adjusting placement of the one or more individual antennas relative to the ferrite substrates to adjust functional properties of the one or more antenna assemblies.

An automated pallet inspection and repair apparatus comprises an inspection station and a repair station. The inspection station comprises a laser that illuminates a pallet, a camera that collects the reflected light and a computer system. The computer system analyzes the output of the camera and acquires the pallet's geometry and topography. The design of the pallet is determined by the computer software. A decision to repair the pallet is made by comparing acquired pallet data against the design criteria. If the pallet needs repair, a recipe of repair steps is constructed by inspecting each of the pallet's elements. The recipe is transmitted to the automated repair station.

A terminal crimping device includes crimp tooling comprising an anvil and a ram movable toward the anvil with a crimp zone being defined between the anvil and the ram configured to receive a wire and a terminal configured to be crimped to the wire by the crimp tooling. An ultrasonic transmitting transducer is coupled to at least one of the anvil and the ram that transmits acoustic signals through the wire and terminal. A filter is provided on at least one of the anvil and the ram in the path of the acoustic signals that affects the acoustic signals.

A terminal crimping device includes crimp tooling comprising an anvil and a ram. A crimp zone is defined between the anvil and the ram. The crimp zone is configured to receive a wire and a terminal. The crimp tooling crimps the terminal to the wire during a crimp stroke. The terminal crimping device also includes an ultrasonic transducer module having at least one ultrasonic transducer held by at least one of the anvil or the ram. The ultrasonic transducer generates a plurality of ultrasonic pulses during the crimp stroke and directs the ultrasonic pluses through the terminal. The ultrasonic transducer receives the ultrasonic pulses and generates ultrasonic data based on the received ultrasonic pulses. The terminal crimp tooling also includes a crimp quality module communicatively coupled to the ultrasonic transducer module. The crimp quality module performs coherent processing of the ultrasonic data to determine a crimp quality.

A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

An electromagnetic chamber absorber provided improved absorption across a wideband and both lower diffuse and specular scatter and a method for constructing the same. An exemplary device can compromise a periodic arrangement of disconnected electromagnetically lossy elements where the periodicity of the lattice is adjusted to suppress all or most grating lobe scattering. Because the electromagnetically lossy elements are disconnected, scalable manufacturing approaches are enabled. The lossy elements can be easily fabricated via shaping, which includes rolling, folding and cutting resistive and/or magnetic sheet materials. The lossy elements can be repeatably placed in a periodic lattice using low density scaffolding approaches and/or other alignment mechanisms. The absorption at the lower frequency part of the electromagnetic bands (below 1-2 GHz) can be improved via the addition of parallel lossy sheets into the low-density scaffolding.

A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

A printed board working apparatus includes a transport device which transports a printed board in a horizontal direction, and a moving member which moves in a horizontal direction above the transport device. The printed board working apparatus includes a plurality of component attaching portions which are aligned in the installation direction and move together with the moving member. The printed board working apparatus also includes at least one working head which performs work on the printed board held by the transport device. The working head is attached to at least one component attaching portion out of the plurality of component attaching portions, and can change a position relative to the moving member in the installation direction. A region where the working head cannot perform work as the number of working heads increases is reduced.