A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.

A consumer electronic product includes at least a transparent housing and a flexible display assembly enclosed within the transparent housing. In the described embodiment, the flexible display assembly is configured to present visual content at any portion of the transparent housing.

A wire operating tool, a component for the wire operating tool, a wire cutting and dividing method, and a wire connecting method are provided. The wire operating tool includes a first wire gripping tool; a first rod member connected to the first wire gripping tool and configured to be expanded and contracted in accordance with relative movement of a moving portion with respect to a base portion; a second wire gripping tool; a second rod member connected to the second wire gripping tool; a connecting member that connects the moving portion of the first rod member and the second rod member to each other in a separable manner; and a load bearing member configured to bear a tensile load acting on the first wire gripping tool and the second wire gripping tool when the moving portion of the first rod member and the second rod are in a separate state.

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

A pressure-sensitive sensor, includes a hollow tubular member including an elastic insulating material; and n electrode wires (n being an integer of not less than 3) arranged away from one another and held inside the tubular member, wherein when an external pressure is applied to the tubular member, the tubular member elastically deforms such that at least two of the n electrode wires contact with each other, and wherein the n electrode wires extend linearly and parallel to a central axis of the tubular member.

A production system includes: a substrate counter configured to count the number of substrates existing in a production line including a mounting device; a mark pattern acquisition unit configured to acquire a mark pattern indicating a pattern of a mark that is provided to each of the plurality of substrates counted by the substrate counter; a determination unit configured to determine whether the respective mark patterns of the plurality of substrates acquired by the mark pattern acquisition unit are the same as each other; and a detection controller configured to control a detection process of the mark pattern by the mounting device based upon a determination result of the determination unit.

A method of forming an electric machine lamination includes punching a sheet having a first composition to form a cavity and a compressed region at a perimeter of the cavity. The method further includes depositing, within the cavity and on the compressed region, a deposit material having a second composition different than the first composition. The method further includes scanning a beam along the deposit material to form a bound material within the cavity and on the compressed region.

A rotor arrangement (1a, 1b) for an electric machine of a vehicle. The rotor arrangement (1a, 1b) comprises a rotor lamination stack (4) and the rotor arrangement further comprises a rotor support (2a, 2b). The rotor support (2a, 2b) carries the rotor lamination stack (4), which is arranged on the radially outer side (6a, 6b) of the rotor support (2a, 2b). A retaining element is arranged on the outer side (6a, 6b) of the rotor support at the end on the rotor lamination stack (4). The retaining element is a one-piece, closed retaining ring (5a, 5b) with an axial ring width (SR) and with at least a first ring diameter (R1). The first ring diameter (R1) is smaller than or equal to the rotor support diameter (TR), so that the rotor laminate stack (4) is secured axially in a rotationally fixed manner. The invention also relates to two production methods.

Disclosed are methods and systems of controlling the placement of micro-objects on the surface of a micro-assembler. Control patterns may be used to cause electrodes of the micro-assembler to generate dielectrophoretic (DEP) and electrophoretic (EP) forces which may be used to manipulate, move, position, or orient one or more micro-objects on the surface of the micro-assembler. The control patterns may be part of a library of control patterns.

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.