Y10T29/5313

Planar cavity mems and related structures, methods of manufacture and design structures

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

Planar cavity MEMS and related structures, methods of manufacture and design structures

A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

CONNECTING STRUCTURE
20210289628 · 2021-09-16 ·

A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

DUAL PURPOSE BOND PADS FOR HEAD SLIDERS AND METHODS OF PROCESSING A SLIDER
20210295863 · 2021-09-23 ·

The present invention is directed to the fabrication of head sliders for use in hard disk drives, and in particular the provision and usage of electrical bond pads on the slider surface structure to accommodate needs of the fabrication process as well as slider operation within a disk drive.

Manufacturing Device and Manufacturing Method for Magnet Embedded Core
20210242756 · 2021-08-05 ·

To allow necessary movement of a magnet in a magnet insertion hole during a manufacturing process so that a magnet embedded core in which the magnet is positioned as designed can be manufactured efficiently, a lower plate (12) and an upper plate (14) configured to contact against the end surfaces of a rotor core (2) are provided with pin members (37, 39) configured to enter a magnet insertion hole (4) to allow movement of a magnet (5) in a first direction, which is a separation direction of two mutually opposing inner surfaces (4C, 4D) of a magnet insertion hole (4), and to restrict movement of the magnet in a second direction orthogonal to the first direction as viewed in the axial direction of the magnet insertion hole (4), in a state where the magnet insertion hole is not filled with resin.

Setting Device for Rotor Core Retaining Jig
20210234440 · 2021-07-29 ·

To automate setting of coupling rods when using a rotor core retaining jig and thereby to improve the production efficiency of a magnet embedded core, a setting device includes: a support base (42) on which the rotor core retaining jig (10) is to be placed; an opposing base (46) joined to the support base 42 to oppose the support base (42); a pressurizing device (48) provided on the opposing base (46) and configured to pressurize an upper plate (14) of the rotor core retaining jig (10) on the support base (42) toward a lower plate (12); chuck devices (126) provided on the support base (42) to releasably grip the coupling rods (30) and capable of moving between a separated position where the coupling rods (30) are separated from engagement grooves (32, 34) and an engaged position where the coupling rods (30) engage the engagement grooves (32, 34); and a fluid pressure cylinder device (120) provided on the support base (42) to drive each chuck device (126) between the separated position and the engaged position.

MOUNTING DEVICE, SYSTEM COMPRISING A MOUNTING DEVICE AND A ROTOR, AND METHOD
20210242757 · 2021-08-05 ·

A mounting device for inserting magnets into magnet accommodating portions of a rotor of an electric machine. The mounting device comprises an aligning device configured to accommodate and align the magnets by means of at least one channel. In this case, a shape of the at least one channel is adapted to a shape of the magnets. The channel comprises a channel inlet, which is disposed at an end face of the aligning device and via which the magnets can be fed to the channel, and a channel outlet, which is disposed opposite the channel inlet and is disposed at an end face of the aligning device opposite the end face and via which the magnets can be discharged from the channel. Furthermore, the at least one channel is twisted.

Apparatus to increase transferspeed of semiconductor devices with micro-adjustment

An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

Electric machine with locally-tuned properties

A method of forming an electric machine lamination includes punching a sheet having a first composition to form a cavity and a compressed region at a perimeter of the cavity. The method further includes depositing, within the cavity and on the compressed region, a deposit material having a second composition different than the first composition. The method further includes scanning a beam along the deposit material to form a bound material within the cavity and on the compressed region.

Rotor Core Retaining Jig, Manufacturing Device and Manufacturing Method for Magnet Embedded Core

To prevent the axial compressive force that acts on the rotor core from becoming unnecessarily large and to enable a high-quality magnet embedded core to be manufactured efficiently, a retaining jig (10) for a rotor core (2) including a magnet insertion hole (4) forming a through hole defining openings on end surfaces in an axial direction includes: a first plate (12) configured to contact against one of the end surfaces of the rotor core (2) and including a gate (20) configured to communicate with the corresponding opening of the magnet insertion hole (4); a second plate (14) configured to oppose another of the end surfaces of the rotor core (2); a closure member (26) coupled to the second plate (14) via a compression spring member (28) and configured to be capable of closing the opening of the magnet insertion hole (4) on the other of the end surfaces; and a coupling member (30) that couples the first plate (12) and the second plate (14) to each other such that the closure member (26) closes the opening and a spring force of the compression spring member (28) becomes a prescribed value.