A circuit card assembly release tool is disclosed. The tool includes a body and two flanges extending outward from the body at an end of the body. The tool is structured and arranged such that the two flanges are adapted to simultaneously apply a force to two ejectors that are pivotally connected to a seated circuit card assembly when the tool is urged in a direction relative to the seated circuit card assembly.

A system and methods for disassembling a rotary machine are provided. The rotary machine includes a casing having a plurality of arcuate channels. The system includes a reaction bridge that is configured to couple to the casing of the rotary machine such that the reaction bridge is moveable along a length of the casing. The reaction bridge includes a front support and a rear support that is substantially parallel to the front support. Each of the supports includes a first leg, a second leg, and a support beam extending therebetween. A force device including an actuator and an engaging rod extending therefrom is coupled to the reaction bridge. The force device is configured to apply a force substantially tangentially to a segment positioned in one of the casing arcuate channels.

The present application provides a device for disassembling electronics, the device comprising transporting means (4) and/or holding means (5) arranged to receive one or more objects containing one or more electronic components, the holding means (5) being adjustable, imaging means (3) for imaging the object and/or measuring means for measuring the object, one or more removal means (6) for removing one or more electronic components from the object, the means being operatively connected to a control unit (1). The present application also provides a method for disassembling electronics with the device.

A detachment chamber for detaching a piezoelectric layer from a piezoelectric donor substrate includes at least one chuck having at least one electrode configured to apply an electric field to the piezoelectric donor substrate to detach the piezoelectric layer from the piezoelectric donor substrate.