A method of joining substrates includes positioning the substrates on a die and pressing a self-piercing rivet until it penetrates into the bottom substrate and deforms the bottom substrate into a relief of the die defined by at least: a raised central portion, an outer portion disposed about a central axis of the die, a side surface disposed about the central axis, and an annular channel disposed about the central axis and disposed, in a radial direction, between the raised central portion and the outer portion. The side surface connects the outer portion to the top surface. The annular channel is recessed axially from the raised central portion and at least a part of the outer portion that is adjacent to the annular channel. The annular channel is radially inward of a toe of the self-piercing rivet after the deforming the bottom substrate into the relief.

A method of joining substrates includes positioning the substrates on a die and pressing a self-piercing rivet until it penetrates into the bottom substrate and deforms the bottom substrate into a relief of the die defined by at least: a raised central portion, an outer portion disposed about a central axis of the die, a side surface disposed about the central axis, and an annular channel disposed about the central axis and disposed, in a radial direction, between the raised central portion and the outer portion. The side surface connects the outer portion to the top surface. The annular channel is recessed axially from the raised central portion and at least a part of the outer portion that is adjacent to the annular channel. The annular channel is radially inward of a toe of the self-piercing rivet after the deforming the bottom substrate into the relief.

The present invention relates to a riveting apparatus capable of preventing fastening omission and a riveting method using the same, and more particularly to a riveting apparatus including a riveting unit, a moving unit connected to the riveting unit, the moving unit being configured to move the riveting unit, a first moving guide unit configured to guide the longitudinal movement of the moving unit, a pair of second moving guide units located at longitudinal opposite ends of the first moving guide unit, the pair of second moving guide units being configured to guide the transverse movement of the first moving guide unit, a first position sensor provided under one end of the first moving guide unit, and a second position sensor provided under one end of one of the pair of second moving guide units and a riveting method using the same.