The present invention provides a method and apparatus of reducing current requirements by increasing resistance of the blade structure by reducing the cross sectional area of at least one section of the blade so that the electrical current requirements for heating of the blade to cutting temperature are reduced wherein the power supply and substantially entire unit may be mounted within a hand held unit. Methods of shaping blades to perform various heat distributions for specialty blades for custom cutting are disclosed. Further, an improved blade mounting structure is provided which includes structure for maintaining the legs of the blade parallel to the direction of cut and provides for easy insertion of new blades by maintaining a slotted blade cradle stable and in alignment with the blades and a clamp member away from the blade when the clamp mounting structure is loosened.

A method of forming a fracture start portion of a con rod for forming fracture start portions of a con rod at opposing positions in an inner peripheral surface of a large end of the con rod made of metal, includes a first step of forming a groove portion at a position corresponding to the fracture start portion by using a first insert tip with a large tip end and a second step of forming the fracture start portion, which has become a V-shaped groove, by machining a bottom portion of the groove portion smaller by using a second insert tip having a tip end smaller than the first insert tip.

Methods of manufacturing electrochromic windows are described. Insulated glass units (IGU's) are protected, e.g. during handling and shipping, by a protective bumper. The bumper can be custom made using IGU dimension data received from the IGU fabrication tool. The bumper may be made of environmentally friendly materials. Laser isolation configurations and related methods of patterning and/or configuring an electrochromic device on a substrate are described. Edge deletion is used to ensure a good seal between spacer and glass in an IGU and thus better protection of an electrochromic device sealed in the IGU. Configurations for protecting the electrochromic device edge in the primary seal and maximizing viewable area in an electrochromic pane of an IGU are also described.

A tool path generating device (20) which generates a tool path (L1) for machining a hairline-shaped long narrow groove (Wa) of on a workpiece surface (W0), includes a shape data acquisition part which acquires shape data of a workpiece, a parameter setting part (23) which sets a shape parameter of a hairline corresponding to the long narrow groove (Wa), and a path generating part (24) which generates a tool path (L1) for a hairline machining, based on the shape data acquired by the data acquisition part and the shape parameter set by the parameter setting part (23).

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.

Methods of manufacturing electrochromic windows are described. Insulated glass units (IGU's) are protected, e.g. during handling and shipping, by a protective bumper. The bumper can be custom made using IGU dimension data received from the IGU fabrication tool. The bumper may be made of environmentally friendly materials. Laser isolation configurations and related methods of patterning and/or configuring an electrochromic device on a substrate are described. Edge deletion is used to ensure a good seal between spacer and glass in an IGU and thus better protection of an electrochromic device sealed in the IGU. Configurations for protecting the electrochromic device edge in the primary seal and maximizing viewable area in an electrochromic pane of an IGU are also described.

The invention relates to methods and apparatus for manufacturing intravascular stents wherein the intravascular stent has its inner surface treated to promote the migration of endothelial cells onto the inner surface of the intravascular stent. In particular, the inner surface of the intravascular stent has at least one groove formed therein.

The invention relates to methods and apparatus for manufacturing intravascular stents wherein the intravascular stent has its inner surface treated to promote the migration of endothelial cells onto the inner surface of the intravascular stent. In particular, the inner surface of the intravascular stent has at least one groove formed therein.

Methods of manufacturing electrochromic windows are described. Insulated glass units (IGU's) are protected, e.g. during handling and shipping, by a protective bumper. The bumper can be custom made using IGU dimension data received from the IGU fabrication tool. The bumper may be made of environmentally friendly materials. Laser isolation configurations and related methods of patterning and/or configuring an electrochromic device on a substrate are described. Edge deletion is used to ensure a good seal between spacer and glass in an IGU and thus better protection of an electrochromic device sealed in the IGU. Configurations for protecting the electrochromic device edge in the primary seal and maximizing viewable area in an electrochromic pane of an IGU are also described.

A method for preparing a polymer insulated cable including a semiconductive layer surrounding a polymeric insulation layer includes: cutting the semiconductive layer by grinding a circumferential dividing groove in the semiconductive layer using a rotating grinding surface, wherein the dividing groove defines first and second semiconductive sections of the semiconductive layer on opposed sides of the dividing groove; and thereafter removing the second semiconductive section from the polymeric insulation layer while retaining the first semiconductive section on the polymeric insulation layer.