The subject invention is directed to a device and method for removing an article attached to a mounting surface by an adhesive mounting. Preferably, the device comprises a first grip, a second grip and a filament having a first end attached to the first grip and a second end attached to the second grip. The filament operates such that when placed between the mounting surface and the adhesive mounting and pulled by the first and second grip in a direction along a bonding plane, it operates to separate the adhesive mounting from the mounting surface.

A wire saw which has excellent cutting ability and which is not easily clogged by chips formed by cutting is provided. It has a body 6 having a first metal wire 1 which is made of a cobalt-based alloy, two second metal wires 2a and 2b which are made of a cobalt-based alloy, and three third metal wires 3a-3c which are made of a cobalt-based alloy and are wound on the first metal wire 1. The second metal wires 2a and 2b are helically wound on each of the third metal wires 3a-3c in opposite directions so as to cross each other. Cutting teeth are constituted by projections 8 which are formed by the crossing points of the two second metal wires 2a and 2b.