A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.

A method for applying at least one enclosing element to a flat product composition wherein the enclosing element is subsequently applied around a selected edge of the product composition in a perpendicular manner with respect to said edge so as to rest against the product composition. A reliable operation that is independent of the type of enclosing element is achieved in that the selected edge of the product composition is moved forward along a transporting path, the enclosing element is held ready at a specified point of the transporting path so as to intersect the transporting path, the selected edge of the product composition is moved past the specified point, and at the same time the selected edge drives the enclosing element that is held ready.

A touch panel includes a first planar body having a first electrode patterned on one surface of a first substrate and a first lead-out wiring electrically connected to the first electrode, a cover sheet, a second planar body provided between the first planar body and the cover sheet except a predetermined region of a side edge of the first substrate, and a flexible wiring board interposed at a gap portion formed between the predetermined region of the side edge of the first substrate and the cover sheet, wherein the flexible wiring board includes a connector portion fixed onto the connection terminal of the first lead-out wiring held by the first planar body and electrically connected with the first lead-out wiring, and a spacer member that abuts with both the connector portion and the cover sheet is disposed between the connector portion and the cover sheet.

A process for preparing a membrane stack comprising the steps of: (i) interposing a curable adhesive between alternate anion exchange membranes and cation exchange; and (ii) curing the adhesive; CHARACTERISED IN THAT said adhesive, when cured, has a Shore A hardness of less than 70 and an elongation at break of at least 50%.

A process for preparing a membrane stack comprising the steps of (i) interposing a curable adhesive between alternate anion exchange membranes and cation exchange; and (ii) curing the adhesive; CHARACTERISED IN THAT said membranes are in a swollen state when step (ii) is performed.

A method and apparatus for forming a composite part. An apparatus comprises a tooling plate, a tab co-bonded with the tooling plate, and a group of alignment features associated with the tab. The tooling plate is configured for use with a tool to form a composite part. The group of alignment features is configured to position the tooling plate with respect to the tool used to form the composite part.

A lens array fabrication method for fabricating a lens array includes: receiving pins of a film attaching instrument (jig) in second guide holes of a film-containing base plate; bonding a placement area and an adhesion layer (F); removing the pins; causing a detachment between a first detachment film (C) and a pressure-sensitive adhesive optical film (D); separating three layers (D) to (F) from two layers (B) and (C); receiving the pins in first guide holes of a lens array main unit; fitting a film holding protrusion in a depression part; bonding the film (D) to a bonding region (i); removing the pins; and causing a detachment between the film (D) and a second detachment film (E).

Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

The present invention is directed to a method of making a door having first and second door facings and an internal doorframe. An interior side of a first facing is coated with quick acting adhesive. A frame is placed on the coated interior side about the periphery of the first facing. The frame is then coated with quick acting adhesive. An interior side of a second facing is placed on the coated frame. The facings and frame assembly are then compressed to form a door. The present invention also provides for an automated system of making the door.

The use of a heat idler moveable along a path provides speed and flexibility in the heat labeling of containers.