A package for a point of sale card that includes a first panel, a second panel coupled to the first panel by an activatable adhesive applied to one of the first panel or the second panel, and a card enclosure region defined between the first panel and the second panel, the card enclosure region configured to receive a point of sale card therein. The activatable adhesive is selectively activated along a perimeter surrounding the card enclosure region to secure the first panel and the second panel together at the perimeter and prevent access to the card enclosure region without irreparable damage to the first panel or the second panel.

A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

A method of making a wooden board assembly includes A) determining a scrap portion of a trunk; B) cutting the trunk horizontally to form multiple boards; C) removing narrow scraps and trimmed sections of each of the multiple boards to obtain multiple trimmed wide boards, and cutting narrow board areas from the scrap portion to form multiple peripheral boards; D) removing a part of the scrap portion and two trimmed sections from each of the multiple peripheral boards; E) connecting the multiple trimmed wide boards and the multiple peripheral boards to form a substrate; F) adhering two straps on the substrate to produce a wood pattern assembly; G) cutting the wood pattern assembly to form multiple cut films; H) adhering one of the multiple cut films with a nonwoven fabric with a transparent adhesive and connecting the multiple cut films on a fixing lamination; and I) cutting the fixing lamination.

A method of making a wooden board assembly includes A) determining a scrap portion of a trunk; B) cutting the trunk horizontally to form multiple boards; C) removing narrow scraps and trimmed sections of each of the multiple boards to obtain multiple trimmed wide boards, and cutting narrow board areas from the scrap portion to form multiple peripheral boards; D) removing a part of the scrap portion and two trimmed sections from each of the multiple peripheral boards; E) connecting the multiple trimmed wide boards and the multiple peripheral boards to form a substrate; F) adhering two straps on the substrate to produce a wood pattern assembly; G) cutting the wood pattern assembly to form multiple cut films; H) adhering one of the multiple cut films with a nonwoven fabric with a transparent adhesive and connecting the multiple cut films on a fixing lamination; and I) cutting the fixing lamination.

Electrochromic device laminates and their method of manufacture are disclosed.

A package for a point of sale card that includes a first panel, a second panel coupled to the first panel by an activatable adhesive applied to one of the first panel or the second panel, and a card enclosure region defined between the first panel and the second panel, the card enclosure region configured to receive a point of sale card therein. The activatable adhesive is selectively activated along a perimeter surrounding the card enclosure region to secure the first panel and the second panel together at the perimeter and prevent access to the card enclosure region without irreparable damage to the first panel or the second panel.

A package for securing a card is disclosed where the card is retained between two panels that are secured together by a heat-activated adhesives and/or a combination of polymeric and adhesive constituents to drastically hinder surreptitious access to the contents of the package. The package may include additional features for activating or accessing the card and increasing the aesthetic appeal of the package.

The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises at least one thermoplastic layer having at least one cavity, an inlay layer, and, and a crosslinked polymer composition. At least one portion of the inlayer layer is disposed inside the at least one cavity of the at least one thermoplastic layer. The crosslinked polymer composition is disposed over the at least one thermoplastic layer and contacting the inlayer layer.

A method and apparatus for forming a composite part. An apparatus comprises a tooling plate, a tab co-bonded with the tooling plate, and a group of alignment features associated with the tab. The tooling plate is configured for use with a tool to form a composite part. The group of alignment features is configured to position the tooling plate with respect to the tool used to form the composite part.