The present invention relates to an adhesive compositions, facestocks and/or packaging labels containing same, where such compositions, facestocks and/or labels are designed to facilitate the recyclability of a plastic article formed from any suitable polymer or mixture of polymers (e.g., a polyethylene terephthalate (PET), high density polyethylene (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE), polypropylene (PP), polystyrene (PS), or others of all plastic types), or even glass bottles. In another embodiment, the present invention relates to a method for removing an adhesive composition, facestock and/or packaging label containing same, from a plastic article that is to be recycled.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

A label assembly including one or more dissolvable thermal direct adhesive labels and methods of assembly and use. According to one embodiment, each label includes a base layer, a thermal direct layer, an adhesive layer, and a barrier layer. The base layer, which has an upper surface and a lower surface, is water-dissolvable and may be made of a water-dissolvable paper. The thermal direct layer is positioned directly over the upper surface of the base layer and functions in the conventional manner to produce markings therein in response to heat. The adhesive layer is water-dissolvable and is positioned below the lower surface of the base layer. The barrier layer, which is positioned directly below the lower surface of the base layer and directly over the adhesive layer, serves to prevent migration of the adhesive layer through the base layer and into contact with the thermal direct layer.

There is disclosed an in-mould labelling process for the manufacture of a labelled article comprising the steps of: feeding a labelstock web into a mould; forming an article in the mould such that the formed article contacts and effectively adheres to a label of the labelstock web; detaching the adhered label from the labelstock web; and removing the formed and labelled article from the mould.

A facility 300 for separation of layers in a multilayer system 310. The facility 300 comprises one or more baths 320a, 320b for accepting the multilayer system 310 and a dispenser 330 for providing a separation fluid 340. The separation fluid 340 comprises a nanoscale dispersion for washing the multilayer system in the baths 320a, 320b and is described in more details below. The facility 300 also includes a filtration device 350 for filtering separated undissolved components of the multilayer system 310.

A carrier plate removing method for removing a carrier plate from a workpiece previously provided through a temporary bonding layer on the front side of the carrier plate is provided. The carrier plate removing method includes a shoulder portion forming step of processing a peripheral portion of the carrier plate along a peripheral edge thereof from the front side of the carrier plate on which the workpiece is provided, thereby forming a shoulder portion as a lower part connected to the back side of the carrier plate, the lower part projecting horizontally outward from the side surface of an upper part connected to the front side of the carrier plate.

A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

The present invention provides a method of promoting separation of polymer bonded to a substrate of different material, which collectively form at least part of a polymer composite structure, the method comprising: (1) contacting the polymer composite structure with a composition comprising organic solvent which is absorbed within one or both of the polymer and substrate, wherein the composition comprising organic solvent does not dissolve either the polymer or the substrate, and (2) contacting the polymer composite structure provided in step (1) with liquid (i) having a temperature higher than the boiling point of the composition comprising organic solvent used in step (1), and (ii) that does not dissolve either the polymer or the substrate, the action of which promotes separation between the polymer and the substrate.

A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof.

A method for manufacturing a substrate having a resin layer, including, in this order: (1) providing the resin layer formed on a support, the support being larger than the outer size of the substrate; (2) bonding the resin layer supported on the support to the substrate; (3) removing an end portion of the resin layer disposed on the end portion of the support and in no contact with the substrate, by a solvent capable of dissolving the resin layer; and (4) peeling off the support from the resin layer.