An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.

The present invention discloses a graphene platelet fabrication method, which comprises Step (A): providing a highly-graphitized graphene having a graphitization degree of 0.8-1.0; and Step (B): providing a shear force acting on the highly-graphitized graphene to separate the highly-graphitized graphene into graphene platelets, wherein the graphene platelets have a length of 10-500 m and a width of 10-500 m and have a single-layer or multi-layer structure. The present invention also discloses a graphene platelet fabricated according to the abovementioned method.

A system according to the principles of the present disclosure includes at least one bracket and at least one vibrator. The at least one bracket is configured to be mounted to a pallet adjacent to a stack of panels disposed on the pallet. The at least one vibrator is attached to the at least one bracket and configured to induce vibration on the stack of panels to disrupt an adhesive bond between adjacent panels in the stack of panels.

An extractor system for extracting an object secured to another object or a base surface is disclosed, which may include an oscillator, an attachment base, and an oscillation control mechanism to limit the transmission of oscillation forces after the object has become unsecured, and preserve the target object in good condition. The attachment base may be a vacuum suction cup or temporary adhesive. The control system may be a mechanical lifting system or an electronic control adapted to cease or minimize application of vibrational force when the object becomes unsecured. Methods of extracting an object or separating two objects secured to each other are also disclosed, including identification or creation of partial unbonded areas beneath the target object to initiate the de-bonding process prior to application of vibrational forces.

An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.