Method and device for delamination/dismantling of multi-layer systems SM comprising several layers including at least one organic layer, wherein the layers are separated by interfaces, characterized in that it comprises at least the following steps: Mixing the multilayer system with a fluid composed of at least one gas having the particularity of causing the swelling of at least one of the layers and one or more non-reactive liquids having the particularity of allowing the separation of each layer unitarily or of subsets of layers composing the multilayer system without degradation of the constituents of the layers, the gas/liquid fluid being raised in temperature and pressure, Recovering separately at least one or more layers or a subset of undegraded layers.

A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.

An apparatus, system, and a method of using the apparatus or system that includes a bladder positioned between tape and an adhesive layer configured to selectively connect the tape to a semiconductor device. The bladder includes one or more chambers that may be selectively expanded to move a portion of the bladder and adhesive layer away from the tape, which may enable the removal of the semiconductor device. The flow of fluid into each of the chambers may selectively expand the chambers. The chambers may have a substantially rounded upper profile or a substantially pointed upper profile. A material within the chambers may be heated to expand the chambers. A plurality of conduits may permit the flow of fluid into the chambers. The conduits may be inserted into the bladder. The chambers may be collapsed after expansion to enable the removal of a semiconductor device from the tape.

The yield of a peeling process is improved. A first step of forming a peeling layer to a thickness of greater than or equal to 0.1 nm and less than 10 nm over a substrate; a second step of forming, on the peeling layer, a layer to be peeled including a first layer in contact with the peeling layer; a third step of separating parts of the peeling layer and parts of the first layer to form a peeling trigger; and a fourth step of separating the peeling layer and the layer to be peeled are performed. The use of the thin peeling layer can improve the yield of a peeling process regardless of the structure of the layer to be peeled.

A duct for distributing one or more telecommunication lines comprises an elongated body having a length and a conduit portion with a lengthwise bore formed therein. The conduit portion contains one or more telecommunication lines. The duct also includes a flange extending lengthwise adjacent the main body to mount the duct to a mounting surface, such as a wall. The duct also includes an adhesive layer disposed on a surface of the flange, the adhesive layer comprising a removable adhesive to permit removal of the duct from the mounting surface after mounting.

Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Provided are adhesive articles and assemblies that include a flat and at least partially elastic backing along with a patterned adhesive coating on each side of the backing. When viewed from directions perpendicular to the backing, the adhesive on one side of the backing does not substantially overlap the adhesive on the opposing side of the backing. As a result, it is possible to use a stretch removable adhesive article that uses, for example, an aggressive adhesive to provide a reliable bond but still remove cleanly and easily from delicate substrates that would otherwise be damaged or destroyed if bonded with conventional adhesive constructions.