A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others.

In a lining material peeling method of peeling a lining material, which is fixedly formed on a surface of a base material, from the base material, a liquefied fluid which evaporates after injection is injected to a boundary between the base material and the lining material.

There is provided a peeling method of a resin sheet for peeling off the resin sheet from a plate-shaped object to which the resin sheet is stuck. The peeling method includes a resin sheet heating step of heating an end part of the resin sheet of the plate-shaped object to which the resin sheet is stuck to turn up the resin sheet from the end part and form a peeling origin point and a resin sheet removal step of removing the resin sheet from the plate-shaped object through peeling off the resin sheet from the peeling origin point.

An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.

An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.

Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

Methods for removing a fiber-reinforced wrap from a fan casing are provided. The method may include heating the fiber-reinforced wrap while on a metal support (e.g., aluminum, steel, etc.) of the fan casing, unwinding a layer of the fiber-reinforced wrap from the fan casing, and winding the layer of the fiber-reinforced wrap onto a collection drum. The fiber-reinforced wrap may heated to a temperature of about 120 C. to about 200 C. (e.g., about 125 C. to about 185 C.). Systems are also generally provided for removing a fiber-reinforced wrap from a fan casing.

A method for separating a window includes providing a display device including a display panel, a window disposed on the display panel and including a color layer. An adhesive layer is disposed between the display panel and the window. Heat is applied to the display device. The method includes inserting a disassembling stick between the display panel and the window to separate an edge of the display panel from the window. The method includes cooling the display device. The method includes separating the display panel and the window from each other.

There is provided a peeling method of a resin sheet for peeling off the resin sheet from a plate-shaped object to which the resin sheet is stuck. The peeling method includes a resin sheet heating step of heating an end part of the resin sheet of the plate-shaped object to which the resin sheet is stuck to turn up the resin sheet from the end part and form a peeling origin point and a resin sheet removal step of removing the resin sheet from the plate-shaped object through peeling off the resin sheet from the peeling origin point.