Y10T156/1153

PREPREG DEBACKER AND METHOD OF LAYUP
20200298547 · 2020-09-24 ·

A method of removing backing film from a sheet element is provided. The sheet element has a preimpregnated layer, and sheets of backing film are adhered to the top and bottom of the preimpregnated layer. The backing film has a different coefficient of thermal expansion than the preimpregnated layer, and a plane of the sheet element is defined by the peripheral edge. A shear strain is created between the backing films and the preimpregnated layer by cooling the sheet element. A fluid stream is directed at a portion of the peripheral edge, the fluid stream being directed in the plane of the sheet element. The fluid stream causes the backing films to separate from the top and bottom of the preimpregnated layer. A differential pressure is simultaneously applied to the backing films relative to the fluid stream to cause the backing films to be removed from the preimpregnated layer.

SYSTEM, METHOD, AND APPARATUS FOR ATTACHING STRUCTURES
20200291196 · 2020-09-17 ·

Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

PATTERNING OF LIQUID CRYSTALS USING SOFT-IMPRINT REPLICATION OF SURFACE ALIGNMENT PATTERNS

Soft-imprint alignment processes for patterning liquid crystal polymer layers via contact with a reusable alignment template are described herein. An example soft-imprint alignment process includes contacting a liquid crystal polymer layer with a reusable alignment template that has a desired surface alignment pattern such that the liquid crystal molecules of the liquid crystal polymer are aligned to the surface alignment pattern via chemical, steric, or other intermolecular interaction. The patterned liquid crystal polymer layer may then be polymerized and separated from the reusable alignment template. The process can be repeated many times. The reusable alignment template may include a photo-alignment layer that does not comprise surface relief structures that correspond to the surface alignment pattern and a release layer above this photo-alignment layer. A reusable alignment template and methods of fabricating the same are also disclosed.

LINING MATERIAL PEELING METHOD

In a lining material peeling method of peeling a lining material, which is fixedly formed on a surface of a base material, from the base material, a liquefied fluid which evaporates after injection is injected to a boundary between the base material and the lining material.

SILICONE COMPOSITION FOR TEMPORARY BONDING ADHESIVE, ELECTRONIC ARTICLE COMPRISING CURED BODY OF THE SAME, AND MANUFACTURING METHOD THEREOF
20200255710 · 2020-08-13 ·

The present disclosure relates to a silicone composition for use as a temporary bonding adhesive comprising: (A) a polydiorganosiloxane having at least two alkenyl groups in each molecule; (B) a polyorganosiloxane having at least one silicon-bonded hydrogen atom in each molecule; and (C) a thermally expandable powder having an expansion ratio of 10 or more.

MICRO DEVICE TRANSFER HEAD ASSEMBLY

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

METHOD FOR DISMANTLING SOLAR CELL MODULE FOR RECYCLING

According to one embodiment of the present invention, a method for dismantling a solar cell module for recycling comprises the steps of: providing a silicon solar cell module in which a silicon solar cell element and one side of glass are bonded together by a sealing agent and a transparent conductive material layer is coated between the side of the glass and the sealing agent; applying a high voltage between the transparent conductive material layer and the other side of the glass; and separating the glass and sealing agent by exposing the silicon solar cell module having the transparent conductive material layer discolored by application of the high voltage to a moisture environment.

DISASSEMBLING METHOD OF DISPLAY MODULE AND REMANUFACTURING METHOD OF DISASSEMBLED DISPLAY MODULE
20200139692 · 2020-05-07 ·

A disassembling method of a display module includes attaching an auxiliary sheet to a display module by using an adhesive tape, the display module including a display panel attached to a window by an adhesive layer, and the auxiliary sheet attached to the display module including an external force applying portion exposed outside an outer edge of the display module; cooling the display module and the auxiliary sheet attached thereto by the adhesive tape; and after the cooling of the display module and the auxiliary sheet attached thereto, separating the display panel and the window from each other by applying force to the external force applying portion of the auxiliary sheet attached to the display module.

Separating polymer from composite structures
10632728 · 2020-04-28 ·

The present invention provides a method of promoting separation of polymer bonded to a substrate of different material, which collectively form at least part of a polymer composite structure, the method comprising: (1) contacting the polymer composite structure with a composition comprising organic solvent which is absorbed within one or both of the polymer and substrate, wherein the composition comprising organic solvent does not dissolve either the polymer or the substrate, and (2) contacting the polymer composite structure provided in step (1) with liquid (i) having a temperature higher than the boiling point of the composition comprising organic solvent used in step (1), and (ii) that does not dissolve either the polymer or the substrate, the action of which promotes separation between the polymer and the substrate.

Hidden feature for accessing or repairing mobile devices
10618192 · 2020-04-14 · ·

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.