A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

A pad removal method includes affixing a first end of a pad guide to a first location of a pad. The method further includes affixing a second end of the pad guide to a second location of the pad. The method further includes moving the first end from a first position, a first distance from the second location, to a second position, a second distance from the second location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the width of the pad.

A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.

The invention provides machines for removing strips of masking from glazing panes. Also provided are methods of removing strips of masking from glazing panes. One embodiment of a machine for removing strips of masking material from a glazing pane includes a cutting head and a processing station. The processing station can be constructed to retain the glazing pane in a processing position with a first surface of the glazing pane oriented toward the cutting head. The cutting head can be movable in various directions across the masked glazing pane and include cutters to cut strips from the masking material.

A labeling device, comprising a scale control assembly (11) and a stripping assembly (12), the scale control assembly (11) being configured to obtain a material strip (10) and to lead out a predetermined length of the material strip (10); the stripping assembly (12) being configured to grasp a target label (101) on the material strip (10) led out by the scale control assembly (11) and to affix the target label (101) to a product (D) to be labeled at a pre-set position so as to obtain a labeled product. Said device controls, by means of the scale control assembly, the length of the material strip that is led out at each time when labeling the product to be labeled, so as to improve the precision of the stripping assembly grasping the label and affixing the label to the product to be labeled.

A peeling apparatus peels a protective member off a wafer, the protective member including a resin and a film which is fixed to one surface of the wafer with the resin interposed therebetween. The film has a protrusive marginal side extending radially outwardly beyond an outer circumferential edge of the wafer. A holding unit holds another surface of the wafer with the protective member disposed therebelow. A gripping unit grips the protrusive marginal side of the protective member. A peeling mechanism peels the protective member off the wafer by relatively moving the gripping unit and the holding unit radially inwardly from the outer circumferential edge of the wafer toward the center of the wafer. A camera then captures an image of the wafer, and a decision unit determines whether residue of the resin remains on the wafer from the image captured by the camera.

A pellicle removal tool including a stage that holds a photomask and an associated pellicle, two or more arms positioned around the stage and configured to engage pellicle side wells of the pellicle, and two or more actuators each configured to adjust at least a vertical position of a corresponding one of the two or more arms so as to apply a lifting force to the pellicle for removal of the pellicle from the photomask.

A film peeling apparatus including a peeling unit, a peeling unit position adjusted, and a clamp. The peeling unit has uneven portions at an end portion thereof. The peeling unit is configured to peel off a protection film attached on a display panel. The peeling unit position adjuster is connected to the peeling unit. The peeling unit position adjuster is configured to adjust a position of the peeling unit. The clamp is disposed separately from the peeling unit. The clamp is configured to clamp the peeling unit.

A system and method for manufacturing a strip or label used to place a substantially invisible identifying mark is disclosed. A strip is treated by removing at least one area of a liner element, a film layer and an adhesive layer. Each one of the removed areas is substantially congruent with the other removed areas. A laser or other ablating device is used to remove the areas through vaporization. The strip element is peeled away from the liner element, exposing the adhesive layer. The adhesive layer is thereafter pressed against a substantially flat metal surface. The laminate top coat and the film layer are removed from the object, leaving the adhesive layer in place. The adhesive material is impregnated with a UV sensitive material, but is otherwise invisible.

An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.