The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 μm and smaller than 1,500 μm, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.

Provided is a substrate holding apparatus capable of appropriately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.

A film-removing apparatus configured to remove a protecting film from a workpiece includes a supporting module configured to support the workpiece, a clamping module configured to clamp the workpiece supported by the supporting module, and a peeling module. The peeling module includes a first peeling member and a second peeling member. The first peeling member includes a bearing surface. The peeling module moves towards the clamping module to bring the bearing surface to below the protecting film, the second peeling member moves towards the protecting film to cooperate with the first peeling member in clamping the protecting member. The peeling module is then moved away from the clamping module to peel off the protecting film.

A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller and a gripper. The winding roller rotates and winds the two-ply sheet to separate the two-ply sheet. The gripper is disposed in the winding roller and configured to grip a gripped portion of the two-ply sheet at one end of the two-ply sheet without abutting a tip of the gripped portion at the one end of the two-ply sheet on a member.

A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

A method of peeling off the protective film includes: providing a panel lower sheet, where a protective film is provided on one surface of the plane lower sheet and the protective film has a bending line extending in a first direction parallel to opposing sides thereof; gripping a portion of the protective film; moving the gripped portion of the protective film in a second direction which is a thickness direction thereof; and moving the panel lower sheet in a third direction perpendicular to the bending line.

The invention relates to a method for peeling a pressure-sensitive adhesive tape including: a pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape has a thickness greater than 150 μm and smaller than 1,500 μm, an elongation at break of 600% to 3,000%, and a stress at break of 2.5 to 80.0 MPa. According to the invention, the conformity and the adhesion with respect to an adherend, particularly, a hard adherend, are excellent, and excellent re-peeling properties are obtained, so that the pressure-sensitive adhesive tape can be stretched and peeled off in a horizontal direction, without necessity for embrittling the pressure-sensitive adhesive tape by heating or by using an organic solvent or the like or without remaining of the pressure-sensitive adhesive on the adherend, in a case of peeling the pressure-sensitive adhesive tape.

A label web and method utilize a substrate, first and second longitudinally spaced label arrays each including two or more double-sided adhesive labels removably attached to the substrate, and a peelable protective covering web extending generally coextensive with the substrate. The label arrays and the peelable protective web are configured such that the peelable protective web is selectively removable to expose the first label array while remaining removably attached to the second label array, with both the first and second label arrays remaining removably attached to the substrate, to thereby facilitate removal of all labels in the first label array as a group while the peelable protective covering web remains in place over the second label array.