A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.

A method for disassembling a stack of at least three substrates. The invention relates to the techniques for transferring thin films in the microelectronics field. It proposes a method for disassembling a stack of at least three substrates having between them two interfaces, one interface of which has an adhesion energy and an interface of which has an adhesion energy, with less than, the method comprising: 1) implementing a removal of material on the first substrate, in order to expose a surface of the second substrate, 2) transferring the stack onto a flexible adhesive film so that the surface has, with an adhesive layer of the film, an adhesion energy greater than, and 3) disassembling the third substrate at the interface between the second substrate and the third substrate. The method makes it possible to open the stack via the interface thereof with the highest adhesion energy.

Provided is a substrate holding apparatus capable of appropnately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.

Disclosed herein is an apparatus for removing material from a surface of a carrier. The apparatus comprises a buckling mechanism that comprises a gripper configured to engage the material. When engaged with the material, the gripper is movable relative to the surface of the carrier to move the material relative to the surface of the carrier and to form a buckle in the material. The apparatus also comprises a separation mechanism that is coupled to the buckling mechanism and comprises a wedge that is movable relative to the surface of the carrier to be insertable into the buckle formed in the material.

A mobile dismantling system includes an automatic frame dismantling apparatus, a fragmenting apparatus, and a conveying apparatus, all of which are disposed on a mobile apparatus, such as a wheeled transport vehicle. The automatic frame dismantling apparatus includes a dismantling platform and frame dismantling members. The fragmenting apparatus includes a back plate fragmenting device and a cell encapsulation laminate fragmenting device, each of which has a fragmenting platform, a fragmenting unit, and a material collecting and sorting device. The conveying apparatus is disposed above the automatic frame dismantling apparatus and the fragmenting apparatus, and includes a robot for moving solar cell module.

A sheet separation device is configured to separate a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at one end as a bonding portion of the two-ply sheet. The sheet separation device includes a conveyance roller pair and circuitry. The conveyance roller pair is configured to convey the two-ply sheet while nipping the two-ply sheet, when separating the non-bonding portion of the two-ply sheet. The circuitry is configured to control sheet conveyance. The circuitry is configured to stop the conveyance roller pair, cause a leading end of the two-ply sheet conveyed toward the conveyance roller pair to contact a nip region of the conveyance roller pair while the conveyance roller pair is stopped, and start the conveyance roller pair to rotate to nip the two-ply sheet.

A pad removal device includes a pad guide extending along a first direction. The pad guide includes a first affixing component configured to affix a first end of the pad guide to a pad at a first pad edge location, and a second affixing component configured to affix a second end of the pad guide to the pad at a second pad edge location opposite the first pad edge location. The pad removal device further includes an actuator attached to the pad guide, and a control assembly coupled to the actuator and configured to cause the actuator to move the first end toward the second end along the first direction. The pad guide is configured to extend in a second direction different from the first direction by an amount dependent on a distance between the first end and the second end.

A manufacturing method and a manufacturing device of a flexible panel are provided. the flexible panel includes a bending area, and the manufacturing method includes: providing a panel unit including a flexible substrate and a back film which are laminated, the panel unit including a panel area corresponding to the flexible panel and a non-panel area outside the panel area; and removing the non-panel area of the panel unit while peeling off a peelable portion of the back film in the bending area of the flexible panel.

A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.

A device for removing a portion of cover is provided, which includes a lower platform and an upper platform oppositely disposed, a cover jig between the lower and upper platforms, a feed roller and a receiving roller oppositely disposed, and an adhesive film. The upper platform includes a plurality of protrusions, and each of the protrusions extends toward the lower platform. The cover jig includes a plurality of through holes, and each of the through holes is disposed opposite to each of the protrusions, so that each of the protrusions can be inserted through each of the through holes. One end of the adhesive film is connected to the feed roller, and the other end of the adhesive film is connected to the receiving roller, and a portion of the adhesive film between the two ends is located between the upper platform and the cover jig.