There is disclosed a cutting mechanism for severing elongate fibre reinforcement material in composite material lay-up equipment, the cutting mechanism comprising a cutting element and a counteracting element which cooperate to sever fibre reinforcement material extending through the nip between them, the cutting element being mounted on an elongate arm which is pivotable about a pivot axis A spaced from the nip, to displace the cutting element relatively to the counteracting element to perform a cutting stroke, the mechanism further comprising guide means arranged to guide the fibre reinforcement material through the nip in a feed direction transverse to the pivot axis A, and an actuation device for driving the elongate arm in a cutting stroke, the actuation device acting on the elongate arm at a position away from the cutting element. There is also provided composite material lay-up equipment comprising the cutting mechanism.

A method for fabricating a composite structure includes steps of: (1) laying up, with a delivery head of a tape placement machine, a continuous segment of a composite tape on a composite panel to form a flange portion of an initial ply of a composite stiffener; (2) locating a backing plate, coupled to the delivery head, relative to the delivery head and the composite panel; and (3) further layup up, with the delivery head, the continuous segment of the composite tape on the backing plate to form a web portion of the initial ply of the composite stiffener.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

The disclosure provides an attaching device for conductive adhesive tape and a manufacturing method of display panel. The attaching device disclosed herein comprises an adhesive tape attaching unit and a frame. An upper portion of the frame is provided with a first guide rail and a pair of second guide rails in parallel. The first guide rail is arranged to be perpendicular to the pair of second guide rails and movably connected between the pair of second guide rails. The adhesive tape attaching unit is movably mounted on the first guide rail. The attaching device for conductive adhesive tape and the manufacturing method of display panel according to the disclosure can attach the adhesive tape to a motherboard. The motherboard with the adhesive tape attached to can be cut to form a plurality of display panels. Therefore, it is possible to improve attaching efficiency and reduce cost of manufacturing.

Method and apparatus are disclosed for drywall banjo tools for applying joint tape. An example drywall banjo for applying joint tape includes a banjo body. The banjo body includes a panel and side walls protruding from outer edges of the panel to define a cavity that is configured to contain joint compound mud. The side walls include a first side wall that extends between an inlet and an outlet. The example disclosed drywall banjo also includes a sloped mound configured to couple to and project away from the first side wall within the cavity. The sloped mound is configured to guide the joint compound mud within the cavity toward the joint tape travelling between the inlet and the outlet to enable the joint compound mud to uniformly collect on a side of the joint tape.

Method and apparatus are disclosed for drywall banjo apparatus for applying joint tape. An example tool for applying joint tape to a corner drywall joint includes a base and a wheel configured to rotatably couple to the base and roll along the corner drywall joint. The wheel includes a body that defines an outer surface. The outer surface includes a first angled surface configured to press the joint tape against a first drywall defining the corner drywall joint, a second angled surface opposite the first angled surface and configured to press the joint tape against a second drywall defining the corner drywall joint, and a rounded vertex defined between the first angled surface and the second angled surface. The rounded vertex is rounded to deter the wheel from perforating the joint tape.

A laying unit for producing a fiber composite component includes a drive device which is formed for magnetic cooperation with a running face, which provides a magnetic field and/or is ferromagnetic, to advance the laying unit on the running face. A device for producing a fiber composite component comprising a laying unit of this type and a method for producing a fiber composite component comprising a device of this type are disclosed.

Method and apparatus are disclosed for drywall banjo tools for applying joint tape. An example tool for applying joint tape includes a base configured to couple to a drywall banjo that dispenses the joint tape. The example tool includes an arm including a proximal end and a distal end opposite the proximal end. The proximal end is rotatably coupled to the base to enable the arm to rotate between an extended position and a retracted position. The example tool includes a corner wheel rotatably coupled to the distal end of the arm to enable the corner wheel to apply the joint tape along a corner drywall joint when the arm is in the extended position. The example tool includes side wheels rotatably coupled to the base to enable the side wheels to apply the joint tape along a flat drywall joint when the arm is in the retracted position.

A joint tape embedding apparatus configured to determine the bonding and/or feel of embedding joint tape into a dry wall or wall board joint using a particular joint compound. The joint embedding apparatus is configured to allow the same user or different users to accurately repeat the determination of the bonding and/or feel attributes of the joint compound.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.