An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.

An automation line for processing a molded panel which is attached, via thermal release adhesive, to a first carrier. The automation line including a release workstation which includes a release unit having a carrier-engagement arrangement movable to engage the first carrier. The carrier-engagement arrangement includes a heating sub-arrangement to thermally contact the first carrier and an attachment sub-arrangement to attach the first carrier to the carrier-engagement arrangement, wherein the carrier-engagement arrangement is operable to heat the intermediate panel assembly to a release temperature of the thermal release adhesive and to separate the first carrier from the molded panel.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

Apparatuses, methods, and systems are disclosed for attaching structures. One system includes: a device having a first structure attached to a second structure; a first polymer coupled to the first structure, wherein the first polymer has a first temperature profile and a first shape; and a second polymer coupled to the second structure. The second polymer has a second temperature profile and a second shape. The second shape interlocks the first shape. The first polymer and the second polymer secure the first structure to the second structure in response to the first polymer and the second polymer being in a first temperature range. The first polymer and the second polymer release the first structure from the second structure in response to the first polymer and the second polymer being in a second temperature range different from the first temperature range.

Methods for removing a fiber-reinforced wrap from a fan casing are provided. The method may include heating the fiber-reinforced wrap while on a metal support (e.g., aluminum, steel, etc.) of the fan casing, unwinding a layer of the fiber-reinforced wrap from the fan casing, and winding the layer of the fiber-reinforced wrap onto a collection drum. The fiber-reinforced wrap may heated to a temperature of about 120 C. to about 200 C. (e.g., about 125 C. to about 185 C.). Systems are also generally provided for removing a fiber-reinforced wrap from a fan casing.

A method for separating a window includes providing a display device including a display panel, a window disposed on the display panel and including a color layer. An adhesive layer is disposed between the display panel and the window. Heat is applied to the display device. The method includes inserting a disassembling stick between the display panel and the window to separate an edge of the display panel from the window. The method includes cooling the display device. The method includes separating the display panel and the window from each other.

There is provided a peeling method of a resin sheet for peeling off the resin sheet from a plate-shaped object to which the resin sheet is stuck. The peeling method includes a resin sheet heating step of heating an end part of the resin sheet of the plate-shaped object to which the resin sheet is stuck to turn up the resin sheet from the end part and form a peeling origin point and a resin sheet removal step of removing the resin sheet from the plate-shaped object through peeling off the resin sheet from the peeling origin point.

Soft-imprint alignment processes for patterning liquid crystal polymer layers via contact with a reusable alignment template are described herein. An example soft-imprint alignment process includes contacting a liquid crystal polymer layer with a reusable alignment template that has a desired surface alignment pattern such that the liquid crystal molecules of the liquid crystal polymer are aligned to the surface alignment pattern via chemical, steric, or other intermolecular interaction. The patterned liquid crystal polymer layer may then be polymerized and separated from the reusable alignment template. The process can be repeated many times. The reusable alignment template may include a photo-alignment layer that does not comprise surface relief structures that correspond to the surface alignment pattern and a release layer above this photo-alignment layer. A reusable alignment template and methods of fabricating the same are also disclosed.

Systems and methods are provided for removing adhesive features. One embodiment is a method for operating a cryogenic-assisted adhesive a removal tool. The method includes dispensing a cryogenic fluid onto an adhesive feature disposed at a surface of a structure, cooling the adhesive feature to cause a physical change making the adhesive feature brittle, and operating the cryogenic-assisted adhesive removal tool to cleave the adhesive feature from the surface while the adhesive feature is physically changed.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.