A system and method for removing a backing from a ply of composite material is disclosed. The system includes a roller having a roller axis and a roller surface that circumscribes the roller axis. The system also includes an adhesion feature disposed on the roller surface. The system further includes a roller drive to move the roller along a travel path that is perpendicular to the roller axis and to rotate the roller about the roller axis.

A method of stripping films which are stuck together without damage is disclosed. The whole reel of films which are stuck together is placed in a sealing device with outlet valves. Liquid nitrogen is added at a bottom of the sealing device. The films are stripped off by a flow of gas through gaps between the layers of the films while the vaporization of liquid nitrogen. The present invention adopts a natural force of liquid nitrogen vaporization to strip the films, which does not compromise the PH value, the dimensional performance and the mechanical performance of the films. The films are in stripped off without damage. The conventional method of stripping the films causes the fragile film to break off or the image layer with a decreased combing power to detach. The present invention has the advantages of simple operation, low cost and good promotion value.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A technique for protecting a portion of a screen panel during a process for disassembling and servicing a display screen device is provided. A first part of the display screen device is separated from a screen panel part of the display screen device, where the screen panel part includes a main screen portion and a circuit of flexible printable circuit board (FPCB) portion. An encapsulant is applied onto a break protectable layer (BPL) of the circuit of flexible printable circuit board (FPCB) portion. The screen panel part is washed, with a solvent to remove residue from the main screen portion.

A separating device and method for a bonded cine film, belonging to the field of image file protection and repair technologies. The separating device comprises a pressurizing device, a separating device and a liquid nitrogen storage device. The pressurizing device is connected to the liquid nitrogen storage device; the liquid nitrogen storage device is connected to the separating device for providing liquid nitrogen thereto; the separating device comprises a film receiving chamber for accommodating a film to be separated; the pressurizing device pressurizes the liquid nitrogen storage device allowing liquid nitrogen to enter the film receiving chamber. Due to a difference between expansion coefficients of a base layer and emulsion layer of the film under low temperature, micro-pores and gaps may be generated in the base layer and the emulsion layer of a bonded film roll; the liquid nitrogen penetrates into the micro-pores and gaps of the bonded film.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

A method for separating and recovering a layered film laminated and adhered with a reactive adhesive, the method including a step 1 of immersing the layered film in an alkaline solution while stirring the layered film with heating at 20? C. to 90? C. or ultrasonically vibrating the layered film and a step 2 of recovering separated single-layered films that constitute the respective layers of the layered film. The reactive adhesive is preferably a reactive adhesive containing a polyisocyanate composition and a polyol composition and more preferably a reactive adhesive containing a polyisocyanate composition, a polyol composition, and a compound having an acidic group.

The invention relates to the use of mixtures of water and essential oils selected from the group consisting of phenols, phenylpropanoids and furanocoumarins, for separating multilayered composites for the segregated recycling of polymer/metal films.

The present application provides a separation apparatus for a flexible display panel, includes a support post, a power unit and a vacuum suction block; wherein the supporting post is used to support the separation apparatus on the relatively upper side of the rigid substrate to be separated; the vacuum suction block is in communication with the support post, and is used to suck and connect the rigid substrate to be separated; and one end of the power unit is connected to the support post, the other end is rotatably connected with the vacuum suction block, and is used for controlling the vacuum suction block and the rigid substrate to be separated together to be separated from the flexible display panel. The present application also provides a method for separating a flexible display panel.