A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A cuff-blade attachment bushing removal tool system includes an alignment plate comprising alignment holes defined through the alignment plate in a pattern of a plurality of bushing holes of a blade root, a bladder plate connected to the alignment plate, and a bladder positioned on the bladder plate such that a gap is formed between the bladder and the alignment plate to receive a blade root to align the alignment holes and the bushing holes of the blade root, wherein the bladder is transitionable between an uninflated position where the blade root can be inserted into the gap and an inflated position where the blade root is clamped between the bladder and the alignment plate.

Methods for removing a fiber-reinforced wrap from a fan casing are provided. The method may include heating the fiber-reinforced wrap while on a metal support (e.g., aluminum, steel, etc.) of the fan casing, unwinding a layer of the fiber-reinforced wrap from the fan casing, and winding the layer of the fiber-reinforced wrap onto a collection drum. The fiber-reinforced wrap may heated to a temperature of about 120 C. to about 200 C. (e.g., about 125 C. to about 185 C.). Systems are also generally provided for removing a fiber-reinforced wrap from a fan casing.

A technique for protecting a portion of a screen panel during a process for disassembling and servicing a display screen device is provided. A first part of the display screen device is separated from a screen panel part of the display screen device, where the screen panel part includes a main screen portion and a circuit of flexible printable circuit board (FPCB) portion. An encapsulant is applied onto a break protectable layer (BPL) of the circuit of flexible printable circuit board (FPCB) portion. The screen panel part is washed, with a solvent to remove residue from the main screen portion.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

An optical fiber coating removal device which heats a coating of an optical fiber with a heater and removes the coating with a blade includes a communicator which receives information based on optical fiber type information to specify an optical fiber type selected by a user from among a plurality of optical fiber types, transmitted from an external device to which the optical fiber type information has been input, and a heater which heats a coating of an optical fiber using the received information based on the optical fiber type information. The heater can heat a coating under a plurality of conditions according to the optical fiber type information.

Method and device for delamination/dismantling of multi-layer systems SM comprising several layers including at least one organic layer, wherein the layers are separated by interfaces, characterized in that it comprises at least the following steps: Mixing the multilayer system with a fluid composed of at least one gas having the particularity of causing the swelling of at least one of the layers and one or more non-reactive liquids having the particularity of allowing the separation of each layer unitarily or of subsets of layers composing the multilayer system without degradation of the constituents of the layers, the gas/liquid fluid being raised in temperature and pressure, Recovering separately at least one or more layers or a subset of undegraded layers.