An apparatus for disassembling a display screen device. The apparatus comprises: 1) a container configured to receive liquid nitrogen into a liquid nitrogen chamber within the container, wherein at least one portion of the container has at least one vent hole that enables cold nitrogen gas to escape from the container; and 2) a cover configured to be brought into contact with the container to thereby form a nitrogen gas chamber that receives the nitrogen gas escaping from the container. The display screen device is disposed within the nitrogen gas chamber. The nitrogen gas freezes exposed surfaces of the display screen device. An adhesive layer disposed in a cooling area of the display screen device proximate an exposed surface loses it adhesiveness as the cooling area becomes colder. The apparatus further comprises an insulation pad disposed within the nitrogen gas chamber and configured to be brought into contact with a protected surface of the display screen device. The insulation pad creates a cooling protect area within the display screen device proximate the protected surface.

The present disclosure provides a method and a system for separating a touch panel from a display module of a touch display device. The system includes a carrying unit configured to secure a to-be-processed touch display device, and a disassembling unit configured to soften an adhesive between the touch panel and the display module so as to separate the touch panel from the display module, thereby to disassemble the touch display device secured on the carrying unit.

An equipment system for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling includes a protective film removing apparatus used for removing a protective film on one side of a photoconversion sheet with protective films on both sides and a roll-bonding apparatus for packaging a flip chip LED array by using the photoconversion sheet containing a protective film on a single side, to form LED package elements. The protective film removing apparatus includes a photoconversion sheet freezing part (2-1, 2-2), a traction part for pulling and removing a protective film on a single side of the frozen photoconversion sheet, and a photoconversion sheet rewarming part (4-1, 4-2) that are sequentially connected and disposed. The roll-bonding apparatus includes two single-wheeled rollers (5-1, 5-2) whose rolling surfaces are both smooth surfaces. The present invention has a significant advantage of bond-packaging an LED by using a continuous rolling process, and can satisfy a requirement of a process for bond-package an LED using an organic silicone resin photoconverter, thereby improving the production efficiency and yield of LED packages in industrialized batch production.

A recycling method includes providing an EVA insole residual product including an EVA foam material, a film, and a cloth material, placing the EVA insole residual product into an oven, heating the EVA insole residual product to a temperature of 13025 C., and detaching the cloth material from the EVA foam material. The film includes an EVA, and a tackifier. The EVA of the film has a mass proportion of 85-95%. The tackifier has a mass proportion of 5-15%. An antioxidant is appended into the film and has a mass proportion of 0.1% of the total mass of the EVA and the tackifier. After the cloth material is detached from the EVA foam material, the EVA foam material and the film are crushed and kneaded and are recycled.

A solar panel cutting unit may include a frame, a transport roller unit provided at the frame to transport, in a first direction, a solar panel having a glass plate, an adhesive layer, a solar cell layer, and a backsheet layer stacked sequentially, a heating unit to heat the solar panel, a pair of pressurization roller units to pressurize and transport the solar panel, a trimmer unit that moves in a second direction perpendicular to the first direction and removes the backsheet layer, the solar cell layer, and the adhesive layer, a peeling unit that inserts a blade into the adhesive layer of the solar panel passing by the trimmer unit and removes a flexible film to which the solar cell layer and the backsheet layer is adhered, and a collection roller that collects the flexible film peeled by the peeling unit.

An apparatus for removing at least one coating from a lengthwise section of an optical fiber includes a heater extending at least partially around and at least partially defining an elongate heating region configured for receiving the lengthwise section of the optical fiber. The heater can heat the heating region to a temperature above the thermal decomposition temperature of the at least one coating. A controller automatically deactivates the heater after removal of the at least one coating from the lengthwise section of the optical fiber in the heating region. Thereafter, an air mover can cause ambient air to cool the heater.

A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.

Soft-imprint alignment processes for patterning liquid crystal polymer layers via contact with a reusable alignment template are described herein. An example soft-imprint alignment process includes contacting a liquid crystal polymer layer with a reusable alignment template that has a desired surface alignment pattern such that the liquid crystal molecules of the liquid crystal polymer are aligned to the surface alignment pattern via chemical, steric, or other intermolecular interaction. The patterned liquid crystal polymer layer may then be polymerized and separated from the reusable alignment template. The process can be repeated many times. The reusable alignment template may include a photo-alignment layer that does not comprise surface relief structures that correspond to the surface alignment pattern and a release layer above this photo-alignment layer. A reusable alignment template and methods of fabricating the same are also disclosed.

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

The present invention provides a procedure of processing a workpiece such as backside grinding of a device wafer and an apparatus designed for the procedure. The procedure comprises (1) preparing a bonded stack comprising (e.g. consisting of) a carrier layer, a workpiece layer, and an interposer layer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet at the junction between two adjacent layers in the stack to separate or debond the two adjacent layers. Technical merits of the invention include enhanced efficiency, higher wafer throughput, reduced stress on workpiece surface, and uniformly distributed stress and avoidance of device wafer breakage and internal device damage, among others.