Described herein is an apparatus and a method for removing an epoxy resin from a backing sheet at a temperature at or below the glass transition temperature of the epoxy resin. The apparatus (200) comprises a housing (210) in which is mounted a dispensing roll (220) comprising epoxy resin (230) on a backing sheet (240), a wind-up roll (250) comprising the backing sheet (240), a release element (260) over which the backing sheet (240) is directed, and a collection tray (270) for collecting pieces of resin (230a) removed from the backing sheet (240). The dispensing and wind-up rolls (220, 250) are mounted on respective drive shafts (225, 255) which are driven by a drive mechanism (285) controlled by a controller (280). A temperature controller (290) is also provided for controlling the temperature within the housing (210) so that it remains below or at the glass transition temperature of the epoxy resin. Angle (a) is chosen to optimize the peel-back angle of the backing sheet (240) after is passes over the release element (260) in relation to the relative spacing between the dispensing and wind-up rolls (220, 250) and the release element (260).

A method for manufacturing a display device includes a stage; a first guide unit positioned on one side of the stage in a first direction and extending in a second direction crossing the first direction; and a first peeling unit disposed on the first guide unit, wherein the first peeling unit includes a first moving part configured to move along the first guide unit, a first rotating part coupled to the other side of the first moving part in the first direction and configured to rotate about an axis extending in the first direction, and a first gripping part coupled to the other side of the first rotating part in the first direction and disposed to overlap the stage.

A film peeling method is disclosed to peel off a film covered on the surface of an object. The method includes the steps of: setting a fulcrum located at outer side of the object; setting a lift-off position on the film; and picking up the film from the lift-off position with the fulcrum as the axis, and applying a circular traction force with a variable radius on the film for peeling off the film from the object. The film peeling method can peel off the film covered on the surface of the object by different peeling stages, to reduce the peeling path and reduce the force required for peeling the film, thereby reducing the peeling time and improving the peeling efficiency.

It would be helpful to provide a wafer separation apparatus and method, and a method for manufacturing a silicon wafer in which poor wafer separation can be easily prevented. A wafer separation apparatus 1 includes an injection port 2 configured to inject a fluid, a rolling element 3, and a holder 4 configured to movably hold the rolling element 3 in a rollable and integral manner, to be reciprocatable and biased to one side in a reciprocating direction, and to be integrally connected to the injection port 2.

This disclosure relates to a film removal apparatus that is suitable for uncovering a film of a semiconductor substrate and includes a carrier, an uncovering mechanism and a lifting mechanism. The carrier supports the semiconductor substrate. The uncovering mechanism includes a slider, a guider and a roller. The slider is slidably disposed on the carrier. The guider is fixed to the slider. The roller is rotatably disposed on the slider and arranged beside the guider. The uncovering mechanism is to uncover the film from the semiconductor substrate. The lifting mechanism selectively separates the semiconductor substrate away from the carrier.

Automatic separation of substrates from spacers within a substrate/spacer stack or laminate for use during a hard disk recording media fabrication process. In one example, a delamination apparatus includes a roller or brush configured to rotate while pressing against a flat surface of a substrate at one end of the laminate to peel the substrate from the laminate to expose an adjacent spacer and to then rotate against a flat surface of the spacer to peel the spacer from the laminate to expose another substrate of the laminate. The apparatus also includes a pusher bar configured to push against the opposite end of the laminate to push the laminate against the roller. The pusher bar may be offset from a central longitudinal axis of the laminate. A bath may be provided for submerging the laminate, the pusher, and the roller in a lubricating liquid. Method embodiments are also described.