An embodiment of this invention provides a separation apparatus for separating a stacked article, such as a semiconductor chip package with sensing functions, comprising a substrate and a cap layer formed on the substrate. The separation apparatus comprises a vacuum nozzle head including a suction pad having a top surface and a bottom surface, a through hole penetrating the top surface and the bottom surface of the suction pad, and a hollow vacuum pipe connecting the through hole to a vacuum pump; a stage positing under the vacuum nozzle head and substantially aligning with the suction pad; a control means coupling to the vacuum nozzle head to lift upward or lower down the vacuum nozzle head; and a first cutter comprising a first cutting body and a first knife connecting to the first cutting body. The cap layer is pressed against by the bottom surface of the suction pad and sucked by the suction pad of the vacuum nozzle head after the vacuum pump begins to vacuum the air within the hollow vacuum pipe and the through hole. Then, the first cutter cuts into the interface between the substrate and the cap layer, and the cap lay is separated from the substrate by the suction force of the vacuum nozzle head and the lift force generated by the upward movement of the vacuum nozzle head.

To address the needs in the art, a method of cleaving substrate material that includes forming an initial crack in a bulk substrate material, where the crack is aligned along a cleaving plane of the bulk substrate material, aligning the cleaving plane between two parallel electrodes in a controlled environment, wherein the parallel electrodes include a top electrode and a bottom electrode, where the cleaving plane is parallel with the two parallel electrodes, where a bottom portion of the bulk substrate material is physically and electrically connected to the bottom electrode, and applying a voltage across the two parallel electrodes, where the voltage is at least 50 kV and establishes a uniform electromagnetic force on the top surface of the bulk substrate material, where the electromagnetic force is capable of inducing crack propagation along the cleaving plane and separating a cleaved substrate material from the bulk substrate material.

A method of making steel fibers, preferably for use as a concrete additive, and for the supply thereof in making steel fiber concrete, characterized in that to form the steel fibers (2) first a sheet-metal strip (1) is notched either on one face or both faces so as to form steel-fiber wires (4) that are initially connected together by webs (5), and that further, for subsequently converting the webs (5) into thin easily mutually separable separation webs forming separation surfaces that are fracture-rough and low in burring upon separation, the steel-fiber strip is subjected to a flexing process in which each web (5) is subjected to multiple bending deformations about its longitudinal axis in such a way that incipient cracks are produced at the webs (5) due to fatigue fracture and thus the separation webs are produced.

A method of forming a scribe line in a strengthened glass substrate includes providing a strengthened glass substrate having a first surface, a second surface, a first edge and a second edge. The first and second surfaces have a strengthened surface layer under a compressive stress, and a central region under tensile stress. The method further includes applying a scoring blade to the first surface at an initiation location that is offset from the first edge by an initiation offset distance greater than a diameter of the scoring blade, and translating the scoring blade or the strengthened glass substrate such that the scoring blade scores the first surface. The translation is terminated such that the scoring blade stops at a termination location that is offset from the second edge of the strengthened glass substrate by a termination offset distance greater than the diameter of the scoring blade.

A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

A presser assembly is provided in which a presser plate or presser board mounting adapter is clamped to a lower end of a presser stem. A rail having a lower channel and an upper channel is provided for clamping the presser plate or presser board mounting adapter to the stem, and more particularly, a presser foot coupled to the lower end of the stem. The present invention allows the presser plate or the presser board mounting adapter to be mounted to the stem without the use of tools or fasteners.

A cell cutting device and a cell cutting method are disclosed. The cell cutting device includes a loading stage configured to load a display sheet including a plurality of display cells, a rotation driving unit connected to the loading stage and configured to rotate the loading stage and to separate the display sheet into the plurality of display cells, and a position change unit connected to the loading stage and configured to change a position of the loading stage.

A splitting apparatus of an LCD panel and splitting method thereof are described. The LCD panel has a first substrate and a second substrate. The splitting apparatus includes a first splitting device and a second splitting device disposed correspondingly to the first splitting device, and the second splitting device includes protrusion adjustment devices. The protrusion adjustment device extrudes the second substrate for forming a protrusion corresponding to a split line to separate a split plate from the first substrate by a deformation portion of the protrusion and to remove the split plate by the first splitting device. The splitting apparatus makes a rapid separation of the split plate.

A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation and increasing the filament length.

Methods and apparatuses for separating sheets of brittle material are disclosed. According to one embodiment, a separation apparatus for separating a sheet of brittle material includes a first separation cam positioned adjacent to a sheet conveyance pathway and a second separation cam positioned opposite from and downstream of the first separation cam. The first and second separation cams may be rotated such that the contact faces of the separation cams periodically extend across a centerline of the conveyance pathway. Rotation of the first and second separation cams may be synchronized such that at least the portion of the contact face of the first separation cam and at least the portion of the contact face of the second separation cam periodically extend across the centerline of the conveyance pathway at a separation time and periodically do not extend across the centerline of the conveyance pathway at a non-separation time.