Y10T428/12014

Refractory metal plates
11443929 · 2022-09-13 · ·

A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.

POWDER REMOVAL FLOATING STRUCTURES

An article of manufacture includes a part structure formed via a first additive manufacturing process and a floating structure within the part structure which is mechanically decoupled from the part structure. The floating structure is formed concurrently with the part structure via the first additive manufacturing process.

WC-Based Cemented Carbide Powder, WC-Based Cemented Carbide Member, and Manufacturing Method for WC-Based Cemented Carbide Member

Provided are a WC-based cemented carbide powder from which a WC-based cemented carbide member excellent in high thermal conductivity and high abrasion resistance can be manufactured, a WC-based cemented carbide member, and a manufacturing method for a WC-based cemented carbide member. The WC-based cemented carbide powder of the present invention includes WC, Cu, and at least one of Co, Fe, and Cr. The content of WC is equal to or more than 40 mass %, the content of at least one of Co, Fe, and Cr is equal to or more than 25 mass % and less than 60 mass %, and the ratio a/b of the content ‘a’ of Cu and the content ‘b’ of at least one of Co, Fe, and Cr satisfies 0.070≤a/b≤1.000.

Transfer method for manufacturing conductor structures by means of nano-inks

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Transfer method for manufacturing conductor structures by means of nano-inks

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

MATERIAL COMPOSITIONS, APPARATUS AND METHOD OF MANUFACTURING COMPOSITES FOR MEDICAL IMPLANTS OR MANUFACTURING OF IMPLANT PRODUCT, AND PRODUCTS OF THE SAME
20220079764 · 2022-03-17 ·

A coated powder composite may include a core particle of Ca or an alloy thereof, or of Mg or an alloy thereof. One or more coating layers may be disposed about the core particle, cladding the core particle. The coated powder composite may be biodegradable.

Cobalt-based alloy powder, cobalt-based alloy sintered body, and method for producing cobalt-based alloy sintered body
11306372 · 2022-04-19 · ·

A Co based alloy powder includes between 0.08% and 0.25% mass of carbon, 0.1% mass or less of boron, between 10% and 30% mass of chromium, 5% mass or less of iron, and 30% mass or less of nickel; the iron and the nickel in a total amount of 30% mass or less; includes at least one of tungsten and molybdenum in a total amount of between 5% and 12% mass; includes at least one of titanium, zirconium, niobium, tantalum, hafnium, and vanadium in a total amount of between 0.5% mass and 2% mass; includes 0.5% mass or less of silicon, 0.5% mass or less of manganese, and between 0.003% and 0.04% mass of nitrogen; and includes cobalt and impurities as the balance of the powder. Crystal grains included in the cobalt-based alloy powder have segregated cells; the cells have an average size of between 0.15 μm and 4 μm.

Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor

An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 μm or more and 15 μm or less and having a median diameter D50 of 2 μm or more and 5 μm or less; a silver powder B having a particle size in the range of 25 μm or more and 100 μm or less and having a median diameter D50 of 30 μm or more and 40 μm or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

ELECTRICALLY CONDUCTIVE PASTE, LAMINATED BODY, AND METHOD FOR BONDING Cu SUBSTRATE OR Cu ELECTRODE TO ELECTRICAL CONDUCTOR

An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor.

An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 μm or more and 15 μm or less and having a median diameter D50 of 2 μm or more and 5 μm or less; a silver powder B having a particle size in the range of 25 μm or more and 100 μm or less and having a median diameter D50 of 30 μm or more and 40 μm or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

METAL FORM CONTAINING DISPERSED AEROGEL PARTICLES IMPREGNATED WITH POLYMERS AND A METHOD OF PRODUCING THE SAME
20210331231 · 2021-10-28 ·

A composite structure including a metal form. The composite structure further includes an aerogel matrix formed of an aerogel, with the aerogel matrix being nanoporous and including a plurality of aerogel pores. A polymer occupies at least a portion of the aerogel pores of the aerogel matrix. The polymer is a thermoplastic. The thermoplastic is nanoporous and includes a plurality of thermoplastic pores. The thermoplastic pores are less than 10 nanometers in size. The polymer is impregnated within the aerogel pores of the aerogel matrix. The aerogel comprises at least 20% by weight of the composite structure. The aerogel pores are less than 10 nanometers in size. The composite structure further contains filler material. The filler material may be graphene. The composite structure further contains reinforcing agents.