Patent classifications
Y10T428/12431
Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate
A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.
Alloy, magnetic core and process for the production of a tape from an alloy
An alloy is provided which consists of Fe.sub.100-a-b-c-d-x-y-zCu.sub.aNb.sub.bM.sub.cT.sub.dSi.sub.xB.sub.yZ.sub.z and up to 1 at % impurities, M being one or more of the elements Mo, Ta and Zr, T being one or more of the elements V, Mn, Cr, Co and Ni, Z being one or more of the elements C, P and Ge, 0 at %≦a<1.5 at %, 0 at %≦b<2 at %, 0 at %≦(b+c)<2 at %, 0 at %≦d<5 at %, 10 at %<x<18 at %, 5 at %<y<11 at % and 0 at %≦z<2 at %. The alloy is configured in tape form and has a nanocrystalline structure in which at least 50 vol % of the grains have an average size of less than 100 nm, a hysteresis loop with a central linear region, a remanence ratio Jr/Js of <0.1 and a coercive field strength H.sub.c to anisotropic field strength H.sub.a ratio of <10%.
ALUMINUM STRIP FOR LITHOGRAPHIC PRINTING PLATE CARRIERS AND THE PRODUCTION THEREOF
A method for producing aluminum strips for lithographic printing plate supports, wherein the aluminum strip is produced from a rolling ingot, which after optional homogenizing is hot-rolled to a thickness of 2 mm to 7 mm and cold-rolled to a final thickness of 0.15 mm to 0.5 mm provides for an aluminum strip having a thickness of 0.15 mm to 0.5 mm and a printing plate support produced from the aluminum strip.
IRON ALLOY WIRE COATINGS FOR WIRELESS RECHARGING DEVICES AND RELATED METHODS
Articles and methods for depositing iron alloy coatings onto metal wires for wireless recharging devices are generally described.
Electrodeposited copper foil and electrode, and lithium-ion secondary battery comprising the same
Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.
Electrolytic copper foil having high-temperature dimensional stability and texture stability, and manufacturing method therefor
The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m.Math.° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
Surface treated copper foil, copper clad laminate, and printed circuit board
A surface treated copper foil 1 includes a copper foil 2, and a first surface treatment layer 3 formed on one surface of the copper foil 2. The first surface treatment layer 3 of the surface treated copper foil 1 has L* of a CIE L*a*b* color space of 44.0 to 84.0. A copper clad laminate 10 includes the surface treated copper foil 1 and an insulating substrate 11 adhered to a surface of the surface treated copper foil 1 opposite to the first surface treatment layer 3.
Advanced electrodeposited copper foil and copper clad laminate using the same
An advanced electrodeposited copper foil and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil has an uneven micro-roughened surface. As observed by a scanning electron microscope operated with a +35 degree tilt and under 1,000× magnification, the uneven micro-roughened surface has a plurality of production direction stripes formed by copper crystals.
Aluminum strip for lithographic printing plate carriers and the production thereof
A method for producing aluminum strips for lithographic printing plate supports, wherein the aluminum strip is produced from a rolling ingot, which after optional homogenizing is hot-rolled to a thickness of 2 mm to 7 mm and cold-rolled to a final thickness of 0.15 mm to 0.5 mm provides for an aluminum strip having a thickness of 0.15 mm to 0.5 mm and a printing plate support produced from the aluminum strip.
METAL MATERIAL WITH THERMODYNAMIC ANISOTROPY AND A METHOD OF PREPARING THE SAME
A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K.sup.−1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K.sup.−1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K.sup.−1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.