The present invention relates to an electrolytic copper foil for a secondary battery and a method of producing the same. The electrolytic copper foil for a secondary battery, in which a burr and curl of a negative electrode plate are inhibited from being formed after an electrolytic copper foil is coated with a negative electrode active material, thereby increasing the loading volume of a negative electrode and increasing a capacity. The electrolytic copper foil for a secondary battery is produced from a plating solution containing Total Organic Carbon (TOC) by using a drum, in which the electrolytic copper foil is formed of one surface that is in direct contact with the drum and the other surface that is an opposite surface of the one surface, and an average cross-sectional grain size of the one surface is 80% or less of an average cross-sectional grain size of the other surface.

Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.

An alloy is provided which consists of Fe.sub.100-a-b-c-d-x-y-zCu.sub.aNb.sub.bM.sub.cT.sub.dSi.sub.xB.sub.yZ.sub.z and up to 1 at % impurities, M being one or more of the elements Mo, Ta and Zr, T being one or more of the elements V, Mn, Cr, Co and Ni, Z being one or more of the elements C, P and Ge, 0 at %≤a<1.5 at %, 0 at %≤b<2 at %, 0 at %≤(b+c)<2 at %, 0 at %≤d<5 at %, 10 at %<x<18 at %, 5 at %<y<11 at % and 0 at %≤z<2 at %. The alloy is configured in tape form and has a nanocrystalline structure in which at least 50 vol % of the grains have an average size of less than 100 nm, a hysteresis loop with a central linear region, a remanence ratio Jr/Js of <0.1 and a coercive field strength H.sub.c to anisotropic field strength H.sub.a ratio of <10%.

Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. In a first aspect, ΔRS between the deposited side and the drum side is at most about 95 MPa, and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. In a second aspect, the deposited side has a Sku of about 1.5 to about 6.5 and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. The characteristics are beneficial to improve the quality of the electrodeposited copper foil, thereby extending the charge-discharge cycle life of a lithium-ion secondary battery comprising the same.

An alloy ribbon that is an alloy ribbon containing a metal as a main component, and has a recess on at least one principal surface, in which a depth of the recess is 5% or more and 75% or less of an average thickness.

A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of grooves and a plurality of micro-crystal clusters. Each of the grooves has a U-shaped or V-shaped cross-section profile, and the grooves have an average maximum width between 0.1 μm and 4 μm and an average depth less than or equal to 1.5 μm. Each of the micro-crystal clusters is composed of a plurality of micro-crystals each having an average diameter less than or equal to 0.5 μm grouped together. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.3. The micro-rough surface has good bonding strength relative to a substrate, and the copper foil substrate has good insertion loss performance to significantly reduce signal loss.

Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.

An alloy is provided which consists of Fe.sub.100−a−b−c−d−x−y−zCu.sub.aNb.sub.bM.sub.c T.sub.dSi.sub.xB.sub.yZ.sub.z and up to 1 at % impurities, M being one or more of the elements Mo, Ta and Zr, T being one or more of the elements V, Mn, Cr, Co and Ni, Z being one or more of the elements C, P and Ge, 0 at %≤a<1.5 at %, 0 at %≤b<2 at %, 0 at %≤(b+c)<2 at %, 0 at %≤d<5 at %, 10 at %<x<18 at %, 5 at %<y<11 at % and 0 at %≤z<2 at %. The alloy is configured in tape form and has a nanocrystalline structure in which at least 50 vol % of the grains have an average size of less than 100 nm, a hysteresis loop with a central linear region, a remanence ratio Jr/Js of <0.1 and a coercive field strength H.sub.c to anisotropic field strength Ha ratio of <10%.

A composite panel having a plurality of carbon plies, a perforated metallic foil comprising several apertures and being secured to the plurality of carbon plies, and a protective layer made from resin secured to the metallic foil. The perforated metallic foil is embedded in the protective layer through its apertures. A free surface of the protective layer forms a top side of the composite panel. The thickness of the protective layer between the top side of the composite panel and the perforated metallic foil is at least 15 micrometers and the perforated metallic foil has a thickness of not more than 30 micrometers. The plurality of apertures in the aggregate defines an open area of not more than 40% of the surface area and a maximum distance between two opposed points in a perimeter of an aperture is equal to or less than 3 mm

A stainless steel foil having a chemical composition comprising, by mass %, C: 0.015% or less, Si: 0.50% or less, Mn: 0.50% or less, P: 0.040% or less, S: 0.010% or less, Cr: 10.0% or more and less than 16.0%, Al: 2.5 to 4.5%, N: 0.015% or less, Ni: 0.05 to 0.50%, Cu: 0.01 to 0.10%, Mo: 0.01 to 0.15%, at least one selected from the group consisting of Ti: 0.01 to 0.30%, Zr: 0.01 to 0.20%, Hf: 0.01 to 0.20%, and REM: 0.01 to 0.20%, where Ti+Zr+Hf+2REM≥0.06 and 0.30≥Ti+Zr+Hf are satisfied.