A metal foil with a karstified topography having a surface morphology in which a maximum peak height minus a maximum profile depth is greater than 0.5 m and extends into the surface at least 5% of the foil thickness, a root mean square roughness is at least about 0.2 m measured in a direction of greatest roughness, and an oxygen abundance is less than 5 atomic %. The foil may be composed of aluminum, titanium, nickel, copper, or stainless steel, or an alloy of any thereof, and may have a coating composed of nickel, nickel alloy, titanium, titanium alloy, nickel oxide, titanium dioxide, zinc oxide, indium tin oxide, or carbon, or a mixture or composite of any thereof. The foil may form part of a metal electrode, current collector, or electrochemical interface. Further described is a method for producing the foil by laser ablation in a vacuum.

An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate 16 having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.

A component for a turbomachine having at least one region made of an intermetallic material which is formed from an intermetallic compound or comprises an intermetallic phase as the largest constituent. The intermetallic material is compacted and/or modified in microstructure by microplasticization at least partially at a surface or interface in a region close to the surface or interface.

A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 m, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 m.

A surface-coated steel sheet of stainless steel is disclosed and has a coating which is made up of at least one metallic corrosion protection layer (1.1) and at least one further layer (1.2) applied to the metallic corrosion protection layer. For such a steel sheet to offer, without a color-imparting organic surface coating, a high-quality impression in terms of aesthetic effect and additionally, have a very high UV resistance, the at least one further layer (1.2) may be a metallic layer or be formed from a metallic layer, where the metallic layer (1.2) is based on nonrusting stainless steel, a chromium- and/or nickel-containing alloy, copper and/or a copper alloy. The at least one further metallic layer (1.2) can optionally be provided with a transparent layer (1.3). Furthermore, a process for producing such a surface-coated steel sheet is described.

A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 mum or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 mum.

A connecting component material used as a material constituting a connecting component, wherein the connecting component material is obtained by using a Ni-plated metal plate in which a Ni plating layer is formed on the surface of a metal plate, and the average depth (R) of a surface roughness motif in at least one direction on the surface of the Ni plating layer is 1.0 m or above, and by forming a Sn plating layer having a thickness of 0.3 to 5 m on the Ni plating layer of the Ni-plated metal plate; the connection component material makes it possible to reduce friction and minimize abrasion of the material when a connecting component such as an electrical connection terminal is fitted, and to improve the reliability of a stable electrical connection; and the connecting component material can be used in e.g., electrical contact components such as lead frames, harness plugs, and connectors used in electrical and electronic devices and the like.

A laminate includes: an insulating substrate; an intermediate layer formed on a surface of the substrate and containing a metal or an alloy as a main component; and a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the intermediate layer. An interface between the intermediate layer and the metal film is plastically deformed.