There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating solutions containing silver nitrate as a silver salt. A sulfonic-acid-containing silver-plating solution, to which a carbon particle dispersing solution (preferably containing a silicate) is added, is used for electroplating a base material (preferably made of copper or a copper alloy) to form a composite plating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.

A die cast component includes an insert element with a plurality of form-fitting elements which are designed for the form-fitting connection of the insert element with a casting material. A ratio of a component wall thickness to a wall thickness of the insert element is a maximum of 4.

The present invention relates generally to a coated jewelry article or a coated component of a jewelry article, comprising a jewelry article or a component of a jewelry article, a first metallic coating, and a second metallic coating.

A product includes an array of cold spray-formed structures. Each of the structures is characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material. A product includes a cold spray-formed structure characterized by having a defined feature size in at least one dimension of less than 100 microns as measured in a plane of deposition of the structure, at least 90% of a theoretical density of a raw material from which the structure is formed, and essentially the same functional properties as the raw material.

An electronic device and a manufacturing method thereof are provided. The electronic device includes an array substrate, which includes a substrate, a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer. The substrate has a substrate surface. The first conductive layer is located on the substrate surface. The first insulating layer is located on the first conductive layer. The second conductive layer is located on the first insulating layer and includes a first sputtering layer, a second sputtering layer, and a third sputtering layer. The second insulating layer is located on the second conductive layer. The second sputtering layer is located between the first and third sputtering layers, and includes a first metal element. The first sputtering layer includes the first metal element and a second metal element. The third sputtering layer includes the first metal element and a third metal element.

The present disclosure relates to an integrated chip structure having a first substrate including a plurality of transistor devices disposed within a semiconductor material. An interposer substrate includes vias extending through a silicon layer. A copper bump is disposed between the first substrate and the interposer substrate. The copper bump has a sidewall defining a recess. Solder is disposed over the copper bump and continuously extending from over the copper bump to within the recess. A conductive layer is disposed between the first substrate and the interposer substrate and is separated from the copper bump by the solder.

A method of forming a hollow structure in an additively manufactured object involves creating a pattern on a surface of a base material of the object with a sacrificial metal filler having a melting point of 350° C. or less, the pattern defining a shape of the hollow structure on the base material. A metal layering material is cold sprayed over the sacrificial metal filler and at least a portion of the base material. The sacrificial metal filler is removed from the pattern by melting the sacrificial metal filler without melting or deforming the base material or the metal layering material to leave the hollow structure in the object formed from the pattern. Non-standard cold spray conditions are used with the metal layering material to prevent damage and or displacement of the filler while still forming a coating of the metal layering material on the filler and base material.

A laminated member as a laminate of a plurality of alloy ribbons is used. The laminated member has a side surface with a fracture surface. A laminated body as a laminate of the laminated member is used. A motor that includes a core using the laminated body is used. A method for manufacturing a laminated member is used that includes: fixing a plurality of amorphous ribbons to one another in a part of layers of the amorphous ribbons after laminating the amorphous ribbons; and punching a laminated member by cutting the laminate of the amorphous ribbons at a location that excludes the portion fixing the amorphous ribbons in the laminate.

Provided is a low-density clad steel sheet having excellent formability and fatigue properties, including a base material; and cladding materials provided on both side surfaces of the base material, wherein the base material is a lightweight steel sheet including, by weight, C: 0.3 to 1.0%, Mn: 4.0 to 16.0%, Al: 4.5 to 9.0%, and a remainder of Fe and inevitable impurities, and each of the cladding materials is martensitic carbon steel including, by weight, C: 0.1 to 0.45%, Mn: 1.0 to 3.0%, and a remainder of Fe and inevitable impurities.

A joining method includes performing a first heat treatment step on a first superalloy workpiece and a second superalloy workpiece wherein at least one of the first and second superalloy workpieces include a gamma matrix phase and a gamma-prime precipitate phase. The first and second superalloy workpieces are joined using a solid state joining process, subjected to a post-weld stress relief operation and a final aging heat treatment.