A shipping label is operable to be applied to a package and includes a single label ply. The single label ply presents longitudinally spaced ends, opposite top and bottom faces extending between the ends, and a generally transverse fold line of weakness spaced between the ends. The label ply is foldable about the fold line to define upper and lower label sections, with the upper label section overlying the lower label section when the label ply is folded, and the top face of the upper label section being operable to receive package address indicia thereon. The upper label section includes a separation line of weakness defining a border portion and a separable central portion. The upper label section includes adhesive applied to the bottom face along at least part of the border portion. The lower label section includes a dividing line of weakness defining a connecting portion and an end portion, with the connecting portion extending between the fold line and dividing line. The end portion is at least in part positioned underneath the central portion of the upper label section when the label ply is folded, with separation of the central portion from the border portion providing access to the end portion thereunder.

A floor panel may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly applied to the substrate using a glue layer available between the printed thermoplastic film and the top side of the substrate. The substrate may be an extruded synthetic material board including a filler selected from the group consisting of chalk, wood and sand. The substrate at least at two opposite edges may include coupling means provided in the extruded synthetic material board. The floor panel may have a thickness of 5 to 10 millimeters.

A trim piece for sealing a work surface including a body having a first side, a second side, and a span disposed between the first side and the second side, wherein the first side and the second side are joined at a junction defining an angle between the first side and the second side of between 80 degrees and 100 degrees, a topcap is affixed to the span of the body, wherein the topcap includes a left side having a first wing and a right side having a second wing, an adhesive is bonded to the first side of the body and an aperture is disposed within the body.

A laminated pane has at least two panes running, for example, parallel to one another, in which case the panes are joined together in an edge area of the laminated pane, at least in sections, with the help of a transparent mass and/or one that becomes transparent after hardening, preferably in form of glue.

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film.

A chip card substrate is provided, which includes a plurality of layers. The plurality of layers includes a first polymer layer including a first polymer material, a second polymer layer disposed over the first polymer layer and a second polymer material different from the first polymer material. The plurality of layers further includes a third polymer layer disposed over the second polymer layer and including the first polymer material. The second polymer layer includes a plurality of cutouts at an edge of the second polymer layer so that the first polymer material of the first polymer layer and of the third polymer layer form a coupling through the plurality of cutouts.

An energy efficient film comprising of first and second substrate layers and microstructures positioned between the first and second substrates is provided. The microstructures are positioned between the first and second structures such that a vacuum environment is created between the first and second substrates. In one embodiment, the insulating film includes a first substrate, a second substrate, and a plurality of microstructures positioned between the first substrate and the second substrate, such that a vacuum environment is created between the first and second substrates and within each microstructure cell, individually. Preferably, the plurality of microstructures is a polygonal cellular network positioned between a first transparent substrate and a second transparent substrate. A gasket may be provided on one or both of the first or second substrates. The gasket may also be provided on outer edges of the first and/or the second substrate.

The present invention relates to tools and system designs for chemical vapor deposition (CVD) systems and CVD synthesis used to deposit one or more thin film layers onto a flexible substrate or to grow nano-structured materials on large area flexible substrates and, more particularly, to scalable CVD coating and nanostructure manufacturing including CVD thin films and nano-structured materials such as nanotubes, nanowires and nanosheets.

A floor board including a decorative surface layer applied to a substrate, where the substrate has MDF or HDF material at a side edge thereof, where the side edge is treated both with an impregnation agent and/or a sealing agent based on a superabsorbing material. Also a method for manufacturing such floor boards.