The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

A polyester film has a maximum surface height on a surface A side (SRmaxA) of 1500 nm to 7000 nm, a maximum surface height on a surface B side (SRmaxB) of 5 nm or more but less than 7000 nm, the SRmaxA and the SRmaxB satisfying the following relation (1), and a strength at break at 25° C. of 200 MPa to 330 MPa in both the longitudinal direction and the width direction.
SRmaxA>SRmaxB  (1)

Provided is a circuit substrate, including a glass film (10) forming a rough layer (11) after surface roughness processing, a resin adhesion (20) located the rough layer (11) on either side of the glass film (10), and a metal foil (30) located on the outside of resin adhesion layer (20). The glass film (10), the resin adhesion layer (20) and the metal foil (30) are joined together through suppressing. The circuit substrate employs the glass film (10) which forms a rough layer (11) after surface roughness processing as a carrier material, so that the resin adhesion layer (20) and the surface of the glass film (10) have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.

One embodiment relates to an, article and a method for producing an article including a plurality of substrates, and an adhesive bonded between at least two of the plurality of substrates. The adhesive can include a polycarbonate copolymer that includes reacted resorcinol, siloxane, and bisphenol-A. Another embodiment relates to an article having a first polyimide substrate, a second polyimide substrate, and an adhesive bonded between the first substrate and the second substrate. The article can have a 2 minute integrated heat release rate of less than or equal to 65 kilowatt-minutes per square meter (kW−min/m.sup.2) and a peak heat release rate of less than 65 kilowatts per square meter (kW/m.sup.2) as measured using the method of FAR F25.4, in accordance with Federal Aviation Regulation FAR 25.853(d).

A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.

An edge trim for pieces of furniture, including a meltable layer, is described. The molecular structure of the meltable layer contains both polar and non-polar parts. By way of a non-limiting example, an edge trim for pieces of furniture having an exposed edge of wooden or wood substitute material is described, comprising a molten layer and a structural layer, wherein the structural layer and the molten layer are connected in an adhesive bond, wherein the molten layer is made of a material that is chemically modified such that polar and non-polar components are found in a single molecular structure, wherein the molten layer contains energy absorbing additives, wherein the energy absorbing additives of the molten layer are selected from the group consisting of metal oxides, metal phosphates, metal salts of organic anions and combinations thereof.

An adhesive film with excellent cuttability with respect to both a base layer and a surface layer or layers laminated thereon is provided, without significant formation of adhesive burrs in various shearing processes. The adhesive film includes a support member and an adhesive layer laminated on at least one side of the support member. The adhesive layer has a laminate structure having a base layer made of a resin-based adhesive and laminated on the surface of the support member and a surface layer made of a resin-based adhesive and laminated on the base layer. The base layer is non-directional and has lengthwise and widthwise shearing strengths of 2 g to 2000 g [200 mm/min, 25 mm] in the thickness range of 2 μm to 60 μm. The base layer has a shearing strength of 1.5 to 200 times the shearing strength of the surface layer.

The present invention relates to a film for a tire inner liner including a base film layer including a copolymer or a mixture of a polyamide-based resin and a polyether-based resin, and an adhesive layer including a resorcinol-formalin-latex (RFL)-based adhesive, and having low shrinkage rate when elongated at a high temperature and then cooled to room temperature, and a method for manufacturing the same.

A non-wicking underlayment board and methods for forming the same. The non-wicking underlayment board includes a foam core formed of closed cell foam with reinforcement layers encapsulated within the foam core. Outer facings formed of mineral coated nonwoven fibers are positioned on opposite faces of the non-wicking underlayment panel. The non-wicking underlayment board is useful for efficient and cost effective installation of barriers and surfaces in water-resistant and waterproof environments.

A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.