The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

In some implementations, an optical interference filter includes a substrate; and a set of layers that are disposed on the substrate. The set of layers includes a first subset of layers, wherein the first subset of layers comprises an aluminum nitride (AlN) material; and a second subset of layers, wherein the second subset of layers comprises a hydrogenated silicon (Si:H) material.

A glass element having a thickness from 25 m to 125 m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

There is provided a skin foam-in-place foamed article comprising a pad (15) and a bag-like outer material (20) covering the pad (15). The outer material (20) has a top layer (21) and a liner layer (22) made of a foamed resin. The liner layer (22) has a closed cell structure. A pad-side skin layer (27a) having a density higher than that of a bulk layer (26) is provided on the liner layer (22), on a side of the pad (15). A corona treatment is applied to the pad-side skin layer (27a).

A glass element having a thickness from 25 m to 125 m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

The adhesive tape includes: a resin layer that is formed by applying resin coating, the resin coating containing a resin having an acid number of 50 mg/g or more and 130 mg/g or less, and at least one type of cross-linking agent selected from between an epoxy-based cross-linking agent and a metal chelate cross-linking agent; and an adhesive layer that is laminated on or above the resin layer, and is formed by applying adhesive coating, the adhesive coating containing a resin including a hydroxyl group, and a metal chelate compound.

The adhesive tape of this application comprises a layer of polymeric material, particularly a polyvinyl chloride, having a Shore A Hardness of between 92 and 100 and a layer of adhesive material attached to a surface of the layer of polymeric material.

The invention relates to an adhesive tape with a carrier composed of a film, there being applied on one side of the carrier an adhesive based on natural rubber or synthetic rubber, where the film is a biaxially oriented film made of polypropylene, polyethylene or polyester such as PET, and on the side of the carrier not coated with adhesive there is a release layer, based in particular on carbamate.

A scratch-resistant glass substrate is prepared by forming a hard, scratch-resistant layer over a major surface of the substrate. The layer is formed from an inorganic material such as a metal oxide, metal nitride, metal carbide, or metal boride using, for example, physical vapor deposition such as reactive or non-reactive sputtering at a process temperature of less than 500 C. The inorganic layer is resistant to micro-ductile scratching, which can safeguard the visible appearance of the glass substrate in use. The glass substrate can include chemically-strengthened glass.

An insulation laminate is disclosed having a base laminate layer, with at least one flat side coated with a layer of an insulating varnish, the insulating varnish including a basecoat; and an added lubricant.