In one embodiment, a selectively-releasable adhesive includes a base adhesive compound and a releasing compound that is blended with the base adhesive compound, the releasing compound being capable of decreasing the adhesive strength of the base adhesive compound when a releasing agent is applied to the selectively-releasable adhesive.

Tie-layer adhesives having graft compositions for bonding to metal substrates is disclosed. The graft compositions are made up of the reaction product of a live, grafted polyolefin and an olefin elastomer. The grafted polyolefin is first made by heating a polyolefin and an unsaturated monomer. Further reaction of the live, grafted polyolefin with an olefin elastomer provides the graft composition. Grafting efficiency is boosted dramatically by the presence of the olefin elastomer and use of the additional reaction step. The graft composition, when formulated into a tie-layer adhesive provides improved bonding to metal substrates.

The present invention relates to a film for flip chip type semiconductor back surface, which is to be disposed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface including an adhesive layer and a protective layer laminated on the adhesive layer, in which the protective layer is constituted of a heat-resistant resin having a glass transition temperature of 200 C. or more or a metal.

Multi-layer laminate materials, which include an aluminum foil layer having particular tensile strength properties, are described. The aluminum foil layer in combination with other layers provides important benefits in manufacturing operations, such as filling tubes made by forming a cylinder from the laminate materials and heat sealing the side and end edges. These benefits are obtained in many cases without the need to increase foil weight or layer thickness. The laminate materials preserve the flexibility of conventional tubes, for example toothpaste tubes, as required to dispense products from a tube opening with the application of manual squeezing forces.

A two part adhesive system is provided with the first part being a substrate-adhesive containing at least one of a urethane, an acrylic, or an epoxy based adhesive and the second part being an elastomer-primer comprising a halogenated polyolefin and, optionally a nitroso compound. Further provided is a method of post-vulcanization bonding of an elastomer to a substrate employing the adhesive outlined above.

The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

A multi-layer polymer film comprising a core layer and a sealing layer, said sealing layer comprises a propylene copolymer composition, said propylene copolymer compositionhas a comonomer content in the range of 3.0 to 8.0 wt.-%, the comonomers are C.sub.5 to C.sub.12-olefins, comprises a polypropylene (A) and a polypropylene (B) in the weight ratio [(A)/(B)] of 20/80 to 80/20, whereinsaid polypropylene (A) has a comonomer content of equal or below 4.0 wt.-%, the comonomers are C.sub.5 to C.sub.12-olefins, andsaid propylene copolymer (B) has a comonomer content of 4.0 to 20.0 wt.-%, the comonomers are C.sub.5 to C.sub.12-olefins.

A multi-layer polymer film comprising a core layer and a sealing layer, said sealing layer comprises a propylene copolymer composition, said propylene copolymer composition has a comonomer content in the range of 3.0 to 8.0 wt.-%, the comonomers are C.sub.5 to C.sub.12 -olefins, comprises a polypropylene (A) and a polypropylene (B) in the weight ratio [(A)/(B)] of 20/80 to 80/20,
wherein said polypropylene (A) has a comonomer content of equal or below 4.0 wt.-%, the comonomers are C.sub.5 to C.sub.12 -olefins, and said propylene copolymer (B) has a comonomer content of 4.0 to 20.0 wt.-%, the comonomers are C.sub.5 to C.sub.12 -olefins.

A multilayer adhesive film comprising surface adhesive layers, an internal Controlled Bond Layer (CBL) comprising a propylene-based polymer strippably adhered to an adjacent layer; an internal Strong Bond Layer (SBL) different than the CBL having a facial surface in adhering contact to the CBL and; optionally, one or more different internal Filler Layer(s) located between the SBL and the adhesive surface layer on the side of the SBL opposite to the adhered CBL. In preferred embodiments the adhesive comprises an ethylene/ethylenically unsaturated carboxylic acid copolymer. The adhesive films are used in cable shielding structures.

A plastics film with improved energy-shielding properties, suitable for application on a transparent or translucent surface, such as glass, and which is at least 50% transparent for visible light, further characterized in that it includes at least one plastic carrier layer with on top thereof as a functional layer a metallic layer consisting of antimony and/or arsenic together with indium and/or gallium, wherein the plastics film contains a total of indium (In), gallium (Ga), antimony (Sb) and arsenic (As) together, which are present as an alloy, such as indium andmonide, gallium andmonide, indium arsenide, indium gallium arsenide and/or gallium arsenide, of at least 4.0 ppm by weight and at most 25.0 ppm by weight. A glass plate to which the film is attached, is described as are objects provided with the glass plate. Methods are described for the production of the film, the glass plate and the objects.