The present disclosure relates to an adhesive film, and adhesive film includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; an adhesive base film layer disposed on the photothermal conversion layer; a buffer layer disposed on the adhesive base film layer; and an adhesive layer disposed on the buffer layer, and the buffer layer includes a polysiloxane resin, and the adhesive layer includes a silicon-based adhesive, and the silicon-based adhesive includes a silicon-based tackifier and a polysiloxane resin. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

A transparent adhesive sheet for optics, which is capable of satisfying both adhesion and rework property, in view of the above problems of prior art. A production method of a silicone-based transparent adhesive sheet for optics for assembling the optical components, includes a step of forming a surface activation treated surface, in which peel strength after laminating onto an adherend increases with time, as compared with peel strength before lamination. The surface activation treatment is performed by using UV-ray irradiation on at least a part or the entire surface of an adhesive face contacting with the adherend of said transparent adhesive sheet for optics.

A mixture having (A) a polymer obtain by polymerizing at least one free-radically polymerizable compound; and (B) at least one compound having at least one ethylenically unsaturated, free-radically polymerizable group and having a weight-average molecular weight Mw of less than 5000 g/mol, wherein at least 10% by weight of compounds (B) are one or more compounds B1 with at least one nonaromatic ring system.

Provided are a solventless composition and a method of preparing the same. Here, the solventless composition may effectively manufacture a film that is uniform without substantial deviation in thickness and has a large but uniform thickness or an excellent physical property such as thermal resistance during manufacture of a film. In addition, the composition of the present invention does not induce contamination during the manufacture of the film. Furthermore, by preventing gelation or phase separation of components of the composition, the composition capable of manufacturing a substrate film having an excellent physical property such as optical transparency, thermal resistance and dimension stability may be provided.

The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt % of a thermoplastic polymer containing carboxylic groups and epoxy groups, 20 to 50 wt % of an epoxy component, 1 to 10 wt % of a hydroxy-containing compound, and 0.1 to 5 wt % of a photoinitiator. The present invention further provides a photocurable adhesive tape comprising the photocurable adhesive composition. The photocurable adhesive composition and the photocurable adhesive tape prepared according to technical solutions of the present invention have excellent adhesiveness to phosphorus-containing nickel-plated substrates.

Provided is a gel nail sticker including: a lower laminated part which is a part directly attached to a nail or a toenail, and has a color or a pattern, and is formed of a flexible material to correspond to a curved surface of the nail or the toenail; and an upper laminated part which is a transparent coated layer positioned on the lower laminated part and providing glossiness to a color or a pattern of the lower laminated part, and is in a flexible semi-solid state to correspond to the curved surface of the nail or the toenail before being attached to the nail or the toenail, and is cured to a solid state while maintaining a form attached to the nail or the toenail when an ultraviolet ray is irradiated to the upper laminated part after the upper laminated part is attached to the nail or the toenail.

A self-adhesive vapor-permeable membrane for use on a building, comprising a support that is permeable to air and water vapor, and a pressure-sensitive adhesive layer that is permeable to air and water vapor, and is secured to the underside of the support, wherein the membrane is noteworthy in that it comprises gas bubbles trapped between the support and the adhesive layer.

A mask-integrated surface protective tape with a release liner, containing: a base film, a temporary-adhesive layer, a release film, a mask material layer, and a release liner, in this order, wherein the release film and the release liner each have one release-treated surface, and the release-treated surfaces of the release film and the release liner each are in contact with the mask material layer, and wherein the peeling strength between the release liner and the mask material layer is smaller than the peeling strength between the release film and the mask material layer.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.