Provided is a masking tape to be used at the time of formation of an electromagnetic wave shield, which is excellent in followability to irregularities, and which is capable of being peeled off from an irregular surface without any adhesive residue. The masking tape for forming an electromagnetic wave shield includes a pressure-sensitive adhesive layer that is increased in modulus of elasticity through active energy ray irradiation to 20 times or more as high as that before the active energy ray irradiation, wherein the pressure-sensitive adhesive layer has a modulus of elasticity after the active energy ray irradiation of 500 MPa or less.

The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.

A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

The present disclosure relates to an adhesive tape and to a method for jacketing an elongated item, more particularly cable sets. The adhesive tape comprises a tapelike carrier provided on at least one side with an adhesive layer which consists of a self-adhesive, pressure-sensitive adhesive, characterized in that the self-adhesive pressure-sensitive adhesive is a UV-curable composition comprising, based on the total weight of the composition: 15 to 50 parts by weight of matrix polymer; 50 to 85 parts by weight of epoxy resin; 0.1 to 3 parts by weight of photoinitiator, with the matrix polymer forming a self-supporting film in which epoxy resin and photoinitiator are embedded.

Plasticizer migration-resistant, UV-curable hotmelt adhesive for graphics films and labels made of plasticized PVC

Described here is a UV-curable hotmelt adhesive largely resistant to plasticizer migration and comprising a UV-crosslinkable poly(meth)acrylate formed from methyl acrylate, C4-18 alkyl (meth)acrylate, monomer with acid groups, copolymerized photoinitiator and optionally further monomers. The hotmelt adhesive further comprises an aliphatic polyester polymer. The use of the hotmelt adhesive on graphics films and self-adhesive labels made of plasticized PVC is also described.

Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (m) of the intermediate layer, a thickness C (m) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A(B/C)D20 (MPa.Math.N).

A mask-integrated surface protective tape with a release liner, containing: a base film, a temporary-adhesive layer, a release film, a mask material layer, and a release liner, in this order, wherein the release film and the release liner each have one release-treated surface, and the release-treated surfaces of the release film and the release liner each are in contact with the mask material layer, and wherein the peeling strength between the release liner and the mask material layer is smaller than the peeling strength between the release film and the mask material layer.