The disclosed hydrophobic adhesive composition comprises a hydrophobic adhesive matrix and water absorbent fibers dispersed throughout the adhesive matrix to provide water management capabilities to the adhesive composition. The disclosed adhesive composition can adhered to a variety of surfaces, such as skin, and will easily remove from the surface. Therefore, the disclosed adhesive is particularly well suitable for application to skin wherein the absorbent fiber can absorb perspiration, water, or wound fluid from skin.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

Adhesive articles that include a substrate, a silicone polyoxamide-containing primer layer, and a silicone adhesive are disclosed. Methods of making the adhesive articles and the use of a silicone polyoxamide as a primer for improving adhesion between a substrate and a silicone adhesive are also disclosed.

The present invention relates to a method of manufacturing an antenna for a radio frequency (RFID) tag. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide a microchip attachment location and to selectively tune an antenna for a particular end use application. The cutting may be performed by a laser, die cutting, stamping or combinations thereof.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

The present application provides a pressure-sensitive adhesive layer comprising at least first and second regions having different physical properties, wherein the difference in physical properties, such as an elastic modulus or creep strain rate is maintained relatively large for each region, and the difference in physical properties, such as a peel force or recovery rate is maintained relatively small for each region.

To provide a method for manufacturing a double-sided adhesive material suitable for the size and shape of various articles using a simple process without reducing the yield of the adhesive material that is used, and to provide an article with a double-sided adhesive material that uses the double-sided adhesive material obtained by this manufacturing method. [Resolution means] Liquid photo curing adhesive 12 is applied by direct drawing onto a specific region corresponding to the size and shape of an article to be used, on the surface of a first plate 10, using a robot. A sheet shaped second plate 20 is placed on the first plate 10 where the adhesive 12 was applied, such that the adhesive 12 is interposed between both plates. Light for curing the adhesive is then irradiated from both sides of the adhesive 12 so that the light will pass through both the first plate 10 and the second plate 20 and reach the adhesive 12.

An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.