Y10T428/2813

Activatable Adhesive, Labels, and Related Methods

An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

FLUID ACTIVATABLE ADHESIVES FOR GLUE-FREE, LINER-FREE, LABELS FOR GLASS AND PLASTIC SUBSTRATES AND METHODS OF USE THEREOF
20170174953 · 2017-06-22 ·

A fluid activatable adhesive for a liner-free label and methods of using are described. Preferably, the adhesive composition includes a polymer, such as an emulsion polymer formed from monomers selected from the group consisting of butyl acrylate, 2-ethylhexyl acrylate, methyl acrylate, 2-acrylamido-2-methylpropane sulfonic acid (AMPS), a salt of AMPS, such as its sodium salt, styrene, and combinations thereof. The adhesive composition adheres to the liner-free label to the surface of a substrate that is at room temperature, at room temperature and wet, cold, or cold and wet. In preferred embodiments, the substrate is glass or plastic, such as polyethylene terephthalate.

Linerless packing and shipping label system
09650177 · 2017-05-16 · ·

A linerless duplex label system is operable to print and apply a linerless duplex label to a substrate. A plurality of linerless duplex labels are provided and each label includes a single-ply stock with top and bottom faces. The label also includes an endless adhesive border applied to the bottom face. The adhesive border is an unactivated, selectively activatable adhesive, such labels are overlaid on one another without any substantial adhesion therebetween. Each label may essentially be freely removed from the others, and the adhesive may thereafter be activated so that the label can be adhesively applied to the substrate.

Activatable adhesive, labels, and related methods

An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Multilayered polymeric film for hot melt adhesive labeling and label stock and label thereof

A polymeric film for labeling articles comprises a core layer (A), a print skin layer (B) comprising a polypropylene homopolymer, a polypropylene copolymer, a high density polyethylene, or a mixture of any of the foregoing polymers and at least 10% by weight based on the weight of the layer (B) of a polyolefin elastomer, an alkene-unsaturated carboxylic acid or acid derivative copolymer, or a mixture of any of the foregoing polymers, and an adhesive skin layer (C) comprising a polypropylene homopolymer, where the polymeric film is oriented. An adhesive containing label stock and an adhesive label die-cut from the adhesive containing label stock comprise the polymeric film which is especially useful for pressure sensitive hot melt adhesive applications.

Bonding material and semiconductor supporting device

The bonding material is formed of a cured sheet composed of an addition curable silicone adhesive agent, and the addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per molecule; an organopolysiloxane resin containing a unit (hereinafter, M) represented by R.sub.3SiO.sub.1/2 (R is a monovalent hydrocarbon group having 1 to 6 carbon atoms and containing no aliphatic unsaturated bond) and a unit (hereinafter, Q) represented by SiO.sub.4/2 in a molar ratio (M/Q ratio) equal to or more than 0.6 to equal to or less than 0.6 to 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst; and a heat conductive filler whose content falls within the range equal to or more than 20 vol % to equal to or less than to 50 vol %.

Adhesive composition, adhesive sheet and production process for semiconductor device

An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Battery packaging material, production method therefor, battery, and polyester film

A battery packaging material including a laminate that is provided with a barrier layer, a heat-fusible resin layer positioned on one surface side of the barrier layer, and a polyester film positioned on the other surface side of the barrier layer. When the infrared absorption spectrum on the surface of the polyester film in 18 directions at intervals of 10 from 0 to 180 is obtained using the total reflection method of Fourier transform infrared spectroscopy, the ratio (surface orientation degree, Y.sub.max/Y.sub.min) of the maximum value Y.sub.max and the minimum value Y.sub.min of the ratio (Y.sub.1340/Y.sub.1410) of the absorption peak intensity Y.sub.1340 in 1340 cm.sup.1 and the absorption peak intensity Y.sub.1410 in 1410 cm.sup.1 in the infrared absorption spectrum is in the range of 1.4-2.7.

BATTERY PACKAGING MATERIAL, PRODUCTION METHOD THEREFOR, BATTERY, AND POLYESTER FILM

A battery packaging material including a laminate that is provided with a barrier layer, a heat-fusible resin layer positioned on one surface side of the barrier layer, and a polyester film positioned on the other surface side of the barrier layer. When the infrared absorption spectrum on the surface of the polyester film in 18 directions at intervals of 10 from 0 to 180 is obtained using the total reflection method of Fourier transform infrared spectroscopy, the ratio (surface orientation degree, Y.sub.max/Y.sub.min) of the maximum value Y.sub.max and the minimum value Y.sub.min of the ratio (Y.sub.1340/Y.sub.1410) of the absorption peak intensity Y.sub.1340 in 1340 cm.sup.1 and the absorption peak intensity Y.sub.1410 in 1410 cm.sup.1 in the infrared absorption spectrum is in the range of 1.4-2.7.