Backing films for adhesive tapes are presented, as well as adhesive tapes comprising such backing films, which may include tapes used in construction such as seam sealing tapes, roofing tapes, and flashing tapes. The backing film comprises a core layer, a first skin layer, and optionally a second skin layer, where the backing film has a coefficient of thermal expansion of less than 90 ppm/° C. measured in at least one direction within the plane of the film, and, in some embodiments, a Young's modulus of less than 550 MPa as measured in at least one direction. In some embodiments, the backing film has a coefficient of thermal expansion of not more than 91.8 ppm/° C. and a Young's modulus of not more than 540 MPa as measured in any direction within the plane of the film. In some embodiments, the core layer comprises a polyolefin, and skin layers comprise a thermoplastic elastomer.

Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing.

The present invention provides switchable adhesives comprising a mixture, in proportions by weight, of 20% to 98% of an adhesive, 2% to 80% of curable molecules and 0.05% to 10% of photoinitiator in which the weight proportion of the adhesive is calculated on the basis of its dry weight and wherein the adhesive includes an internal cross-linker for cross-linking the adhesive during drying to provide a cohesive strength of between 5 and 100 N/12.7×12.7 mm measured according to FINAT test method No. 18. Preferably, the adhesive and curable molecules are mutually soluble when dry, or the curable molecules and adhesive may be uniformly dispersed in each other. Preferably the amount of adhesive in the mixture is in the range 40% to 98% by weight, more preferably 60% to 95% by weight, even more preferably 70% to 85% by weight. Preferably the proportion of curable molecules in the mixture ranges from 2% to 60% by weight, more preferably 5% to 40% by weight, even more preferably 15% to 30% by weight. Preferably, the photoinitiator is present in the mixture in the proportions 0.5% to 5% by weight, more preferably 1% to 3% by weight. Such switchable adhesives are useful in medical dressings and other removable sheet products, and may be simply prepared by stirring the adhesive, the curable molecules and the photoinitiator together at room temperature.

Removable flooring, which can be peeled from a flooring substrate is prepared by applying to an adhesive layer attached to the surface of a flooring substrate a particulate material followed by application of a cross-linkable or curable polymer composition, or by applying to the adhesive layer a slurry comprising the particulate material and the cross-linkable or curable polymer composition. The cross-linkable or curable polymer composition surrounds the particulate material and adheres to the adhesive layer to provide, upon cure, a coherent, flooring layer comprising the adhesive, particular material and cured polymer which can be peeled from the underlying flooring substrate as a single substrate.

An impact-resistant film comprises at least one layer of an elastomeric polymer material and an adhesive layer.

Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (μm) of the intermediate layer, a thickness C (μm) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D≥20 (MPa.Math.N).

The present disclosure relates to an adhesive film, and adhesive film includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; an adhesive base film layer disposed on the photothermal conversion layer; a buffer layer disposed on the adhesive base film layer; and an adhesive layer disposed on the buffer layer, and the buffer layer includes a polysiloxane resin, and the adhesive layer includes a silicon-based adhesive, and the silicon-based adhesive includes a silicon-based tackifier and a polysiloxane resin. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

A double-sided adhesive tape includes a substrate, and a thermosetting resin layer laminated on both sides of the substrate. The thermosetting resin layer contains a rubber-modified epoxy resin and a latent curing agent. The thermosetting resin layer has a flowtester viscosity at 40° C. and under a load of 20 Kg of 1000 Pa.Math.s or more and 7000 Pa.Math.s or less.

Intermediate laminates and articles comprising a low adhesion backsize coating are described. The laminate comprises a substrate having a major surface and opposing surface and a coating comprising a block copolymer disposed on a major surface of the substrate wherein the block copolymer comprises a polyorganosiloxane block and a polyolefin block, the polyolefin block having a melt point of at least 110° C. Also described are medical dressings comprising such laminate.

The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).