Methods of forming semiconductor structures include providing a polymeric material over a carrier substrate, bonding another substrate to the polymeric material, and lowering a temperature of the polymeric material to below about 15° C. to separate the another substrate from the carrier substrate. Some methods include forming a polymeric material over a first substrate, securing a second substrate to the first substrate over the polymeric material, cooling the polymeric material to a temperature below a glass transition temperature of the polymeric material, and separating the second substrate from the first substrate. Semiconductor structures may include a polymeric material over at least a portion of a first substrate, an adhesive material over the polymeric material, and a second substrate over the adhesive material. The polymeric material may have a glass transition temperature of about 10° C. or lower and a melting point of about 100° C. or greater.

Disclosed are powerful adhesive tapes, which rapidly coat rough and/or curved surfaces with different surface energies and thereby build up high adhesion. The adhesive joints formed in this way furthermore have good shear strength, even at elevated temperatures. Finally, enduring mechanical loading on the adhesive joints does not lead to the adhesive tape peeling from the surface. This is achieved with an adhesive tape comprising at least one foamed layer and at least one adhesive compound layer, wherein the adhesive compound layer contains at least one poly(meth)acrylate, and the poly(meth)acrylate is cross-linked with at least one covalent and at least one coordinative cross-linker.

The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.

A protective film 10 of the present invention is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21 while heating the resin substrate 21. The protective film 10 includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate 21 and is adhered to the resin substrate 21. The base material layer is formed of a laminate having a first layer which is positioned on the opposite side of the pressure sensitive adhesive layer, contains a thermoplastic resin, and has a melting point of 150° C. or higher and a second layer which is positioned on the pressure sensitive adhesive layer side, contains a thermoplastic resin, and has a melting point of lower than 120° C.

A marking tape for application on pavement which comprises a core layer and an adhesive layer outside the core layer. The core layer is formed of a combination of a conforming layer of a thermoplastic material, a marking layer of a cross-linked material, and a fibrous layer. The conforming layer and the marking layer are contiguous and/or directly interconnected with each other. The marking tape is preferably relatively light weight and relatively inexpensive.

The invention discloses a high performance plastic magnetic material, comprising a low surface energy layer, a magnetic layer and a printable layer, wherein the magnetic layer and the printable layer are arranged successively on a first side of the low surface energy layer; the low surface energy layer is an organic silicon pressure sensitive adhesive layer. The invention further discloses a preparation method, comprising the following steps: pretreating a magnetic powder with a coupling agent; mixing the pretreated magnetic powder with matrix components and auxiliaries to gain a mixture; extrusion compositing the gained mixture with a printable layer to gain composite paper having the printable layer and a magnetic layer; and applying a low surface energy layer on a side of the magnetic layer, opposite the printable layer. As no UV layer and no adhesive residue, the material of the invention is environmentally friendly and highly reliable.

A light shielding tape includes a first adhesive layer, a textile base layer disposed on the first adhesive layer, a resin base layer disposed on the textile base layer, and a first light shielding layer disposed on the resin base layer. The first light shielding layer includes black pigment.

An object of the invention is to provide a film having excellent weatherability. The present invention provides a film comprising: a base layer formed of a thermoplastic resin, and a fluororesin layer laminated to one face of the base layer, wherein the fluororesin layer contains a tetrafluoroethylene resin and a photostabilizer. The present invention also provides a method of manufacturing a fluororesin composition suitable for manufacturing the film. The method of manufacturing comprises a dissolving step in which a photostabilizer is dissolved in ester-based, ketone-based, or aromatic solvent to obtain a solution and a mixing step in which the solution is mixed with a fluororesin comprising tetrafluoroethylene resin.

The present method comprises providing a flexible web substrate (e.g., polymeric flexible web substrates) that forms at least part of a component of a device, coating so as to wet-out on and cover all or a substantial portion of a major surface on one side or both sides of the flexible web substrate with flowable polymeric material, while the flexible web substrate is moving in a down-web direction, and solidifying the polymeric material so as to form one cleaning layer on the major surface of one side or both sides of the flexible web substrate. The present invention can be utilized in a continuous in-line manufacturing process. In applications of the present invention where the flexible web substrate will not form a component of a device, the present invention broadly provides a method for cleaning particles from a flexible web of indefinite length. Each cleaning layer forms a substantially adhesive bond to the major surface that is readily removable without damaging or leaving a substantial residue of cleaning layer material on the major surface. A substantial number of the particles that were on this major surface are captured by and removable with the cleaning layer.

The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.