The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor using a composition having the following (a) to (c): (a) a first organic compound represented by Formula (1) below (R represents a hydrogen atom or a glycidyl group. A plurality of Rs may be identical to or different from each other, but each of at least two Rs is a glycidyl group), (b) a second organic compound represented by Formula (2) below, and (c) a photocationic polymerization initiator ##STR00001##

A fiber reinforced powder paint provides improved flexural fatigue resistance for composites substrates. Fiber loading in the powder is greater than 40%. Aramid fiber loading in an epoxy based powder paint is exemplified. A composite bow limb coated with the powder paint survives a remarkably greater number of bending cycles before failure when coated with the powder paint.

The laminate according to the invention is a multiple layer structure and contains predominantly urethane-based polymeric materials in the cap and base layers thereof, with no significant amount of PVC. As such, under combustion conditions, the laminate releases substantially no harmful halogen-based bases, such as HCl or other toxic gases, and exhibits toxicity and smoke generation parameters well below acceptable industry standards.

A layered construction is provided having a storage modulus G.sub.t25 at 25 C., comprising: a) a cured polymeric composite having a storage modulus G.sub.s25 at 25 C.; and b) a cured surfacing film bound thereto; wherein G.sub.t25 is not greatly elevated over G.sub.s25, typically not more than 118% of G.sub.s25. In some embodiments the cured surfacing film comprises an electrically conductive layer, typically a metal layer. In some embodiments the cured surfacing film comprises a cured epoxy resin which may optionally be a chain-extended epoxy resin and may excludes phosphorus. The resulting layered construction may display high erosion resistance, high corrosion resistance, and high resistance to microcracking. In another aspect, methods of making the subject layered constructions are provided.

The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. An information carrying card includes a body defining a first cavity and a second cavity. The first cavity has a first area and the second cavity has a second area. The first cavity is continuous with the second cavity and the second area is less than the first area. A circuit element is disposed within the first cavity.

In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Protection barriers, such as floor protection barriers, and methods for making and using same. The protection barrier can include a base sheet and an energy absorbing layer. The base sheet can have two or more paperboard layers and one or more sizing layers. A first paperboard layer can form a first surface of the base sheet, a second paperboard layer can form a second surface of the base sheet, and the one or more sizing layers can be disposed between the first and second paperboard layers. The energy absorbing layer can be secured to the second paperboard layer.

A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 mol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 m or less in ten-point average roughness Rz.

A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.