The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

Provided is a flexible and self-supporting insulating film including a base polymer layer and a partially cured poly(amide)imide layer applied to the base polymer layer. The composite insulating film may be used as slot liner to provide insulation to the components of the electric motor. The partially cured poly(amide)imide layer of the composite insulation film maybe further cured by the heat generated by the operation of the electric motor.

The present invention provides an optical layered body which stably keeps light resistance such as ultraviolet resistance and oxidation resistance while keeping conventional physical properties and optical properties as the outermost surface material of an image display device, which is excellent in an antistatic property and which is capable of providing high image contrast when employed for an image display device. The optical layered body has a light transmitting substrate and a resin layer formed on one surface of the light transmitting substrate and is characterized in that the resin layer contains a binder resin, a polythiophene, an auxiliary conductive agent, and a leveling agent.

Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

The present invention relates to a process for the production of a layer composition (10) with an electrically conductive layer (11), comprising the process steps: a) provision of a substrate (12) with a substrate surface (13); b) formation of a polymer layer (14) comprising an electrically conductive polymer (15) on at least a part of the substrate surface (13); c) application of a liquid stabilizer phase, comprising a stabilizer and a liquid phase, to the polymer layer (14) from process step b), wherein the stabilizer phase comprises less than 0.2 wt. %, based on the stabilizer phase, of the electrically conductive polymer,

wherein the stabilizer is an aromatic compound with at least two OH groups, and a layer composition (10) and uses thereof.

A method for producing a device substrate by obtaining a laminate comprising a carrier substrate, a first polyimide film comprising a first polyimide resin disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film opposite to the surface of the first polyimide film formed on a surface of the carrier substrate; applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the cross-sections of the second polyimide film are exposed and cross-sectional surfaces of the first polyimide film are not exposed and no physical stimulus is applied to the surface of the carrier substrate, wherein the adhesive strength of the first polyimide to the second polyimide film decreases when the second polyimide film in the laminate is cut to expose cross-sectional surfaces of the second polyimide film; and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.

In one embodiment, a chalcogenide glass optical fiber is produced by forming a billet including a chalcogenide glass mass and a polymer mass in a stacked configuration, heating the billet to a temperature below the melting point of the chalcogenide glass, extruding the billet in the ambient environment to form a preform rod having a chalcogenide glass core and a polymer jacket, and drawing the preform rod.

The present invention relates to a process for the production of a layer composition (10) with an electrically conductive layer (11), comprising the process steps: a) provision of a substrate (12) with a substrate surface (13); b) formation of a polymer layer (14) comprising an electrically conductive polymer (15) on at least a part of the substrate surface (13); c) application of a liquid stabilizer phase, comprising a stabilizer and a liquid phase, to the polymer layer (14) from process step b), wherein the stabilizer phase comprises less than 0.2 wt. %, based on the stabilizer phase, of the electrically conductive polymer, wherein the stabilizer is an aromatic compound with at least two OH groups, and a layer composition (10) and uses thereof.

The present invention refers to a multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, the barrier film comprises at least one nanostructured layer comprising reactive nanoparticles capable of interacting with moisture and/or oxygen, the reactive nanoparticles being distributed within a polymeric binder, and at least one ultraviolet light neutralizing layer comprising a material capable of absorbing ultraviolet light, thereby limiting the transmission of ultraviolet light through the barrier film.

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200? C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.